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Référence fabricant
24AA02E48T-E/OT
24AA02E48 Series 2 Kb (256 x 8) 5.5 V SMT I2C Serial EEPROMs - SOT-23-5
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3000 par Reel Style d'emballage :SOT-23-5 (SOT-25) Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2446 | ||||||||||
Microchip 24AA02E48T-E/OT - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
***FPCN108989 UPDATE***Description of Change: Qualification of 8008MD as a new die attach material and CuPdAu as a new wire material for selected various products available in 5L SOT-23 package assembled at MTAI.Revision History: November 18, 2024: Issued initial notification.January 27, 2025: Issued final notification. Attached the Qualification Report. Provided Estimated firstship date to be on February 28, 2025.Reason for Change: To improve manufacturability by qualifying 8008MD as a new die attach materialand CuPdAu as a new wire material
Description of Change: Qualification of 8008MD as a new die attach material and CuPdAu as a new wire material for selected various products available in 5L SOT-23 package assembled at MTAI.Reason for Change: To improve manufacturability by qualifying 8008MD as a new die attach material and CuPdAu as a new wire material
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8008MD as a new die attach material for selected 24LCxxx, 24AAxxx and 24FCxxx device families available in 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material and 8008MD as a new die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:August 20, 2024 (date code: 2434)
Microchip has released a new Datasheet for the 2-Kbit I2C Serial EEPROMs with EUI-48 or EUI-64 Node Identity of devices. Notification Status: FinalDescription of Change:Added automotive product offering; Updated SOT-23 package drawings.Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 02 Sep 2023
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected 24LCxxx, 24AAxxx and 24FCxxx device families available in 5L SOT-23 package assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Microchip has released a new Datasheet for the 24AA02E48/24AA025E48/24AA02E64/24AA025E64 2-Kbit I2C Serial EEPROMs with EUI-48? or EUI-64? Node Identity Data Sheet of devices. Description of Change:Updated SOIC and SOT-23 package drawings; Replaced terminology ?Master? and ?Slave? with ?Host? and ?Client?, respectively; Replaced ?Automotive (E):?designation with ?Extended (E):? designation; Reformatted some sections for better readability.Impacts to Data Sheet: NoneChange Implementation Status: CompleteDate Document Changes Effective: 20 Sep 2022
Statut du produit:
Microchip 24AA02E48T-E/OT - Caractéristiques techniques
| Memory Density: | 2kb |
| Memory Organization: | 256 x 8 |
| Supply Voltage-Nom: | 1.7V to 5.5V |
| Supply Current: | 0.1mA |
| Clock Frequency-Max: | 400kHz |
| Write Cycle Time-Max (tWC): | 5ms |
| Data Retention: | 200 yr |
| Interface Type: | I2C |
| Access Time-Max: | 900ns |
| Operating Temp Range: | -40°C to +125°C |
| No of Terminals: | 5 |
| Style d'emballage : | SOT-23-5 (SOT-25) |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
3000 par Reel
Style d'emballage :
SOT-23-5 (SOT-25)
Méthode de montage :
Surface Mount