
Référence fabricant
SST39SF010A-70-4I-NHE
SST39SF Series 1 Mbit 128 K x 8 5 V Multi-Purpose Flash - PLCC-32
Microchip SST39SF010A-70-4I-NHE - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change:Qualification of MTAI as an additional final test site for selected SST39SF040, SST39SF020A and SST39SF010A device families available in 32L PLCC (11.5x14x3.37mm) package.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying MTAI as an additional final test site.
PCN Status: Final notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of MTAI as an additional Scan/Pack process site and implement packing changes for selected products available in 32L PLCC (11.5x14x3.37mm) package.Impacts to Data Sheet: NoneChange Impact: NoneReason for Change: To improve on-time delivery performance by qualifying MTAI as an additional Scan/Pack process site.Change Implementation Status: In ProgressEstimated First Ship Date: February 03, 2022 (date code: 2206)See attached PCN for full details
Description of Change: Implement MMT shipping tube for selected AT27xxxx, AT28xxxx and SST39xxxx products available in 32L PLCC package.Pre Change:LPI shipping tubePost Change:MMT shipping tubeReason for Change:To improve on-time delivery performance by implementing MMT shipping tube Estimated First Ship Date:December 26, 2020 (date code: 2052)
PCN Status: Final notification. PCN Type: Manufacturing ChangeDescription of Change: Implement MMT shipping tube for selected AT27xxxx, AT28xxxx and SST39xxxx products available in 32L PLCC package.Pre Change: LPI shipping tube Post Change:MMT shipping tube Impacts to Data Sheet: None Change Impact:None Reason for Change:To improve on-time delivery performance by implementing MMT shipping tubeChange Implementation Status:In Progress Estimated First Ship Date:December 26, 2020 (date code: 2052)
Revision History:April 21, 2020: Issued initial notification.September 18, 2020: Issued final notification.October 20, 2020: Re-issued the final notification to include the Qualification Report. Corrected pre and post change to correct the word bond wire to die attach material.Description of Change: Qualification of MMT as a new assembly site for selected SST39xxx products available in 32L PLCC (11.5x14x3.37mm) package.Pre Change:Assembled at LPI or GTK assembly site using 8340 die attach and C151 lead frame material.Post Change:Assembled at MMT using 3280 die attach and A194 lead frame material.Pre and Post Change Summary: See attachedImpacts to Data Sheet: NoneChange Impact:NoneReason for Change:Due to unforeseen business conditions, MMT has been qualified as a new assembly effective immediately.Change Implementation Status:In ProgressEstimated First Ship Date:September 20, 2020 (date code: 2039)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts
Final Notice: Qualification of MMT as a new assembly site for selected SST39xxx products available in 32L PLCC (11.5x14x3.37mm) package.Description of Change: Qualification of MMT as a new assembly site for selected SST39xxx products available in 32L PLCC (11.5x14x3.37mm) package.Due to unforeseen circumstances, that are out of Microchip�s control, full qualification will be made available at a date after shipment as Microchip plans to continue fulfill orders by shipping from the new assembly site as soon as possible as to not disrupt customer orders.Pre Change: Assembled at LPI or GTK assembly site using 8340 bond wire material and C151 lead frame material.Post Change:Assembled at MMT using 3280 bond wire material and A194 lead frame material.
CCB 4218 Initial Notice: Qualification of MMT as a new assembly site for selected SST39xxx products available in 32L PLCC (11.5x14x3.37mm) package.Description of Change:Qualification of MMT as a new assembly site for selected SST39xxx products available in 32L PLCC (11.5x14x3.37mm) package.Pre Change:Assembled at LPI or GTK assembly site using 8340 bond wire material and C151 lead frame material.Post Change:Assembled at MMT using 3280 bond wire material and A194 lead frame material.Reason for Change:To improve manufacturability by qualifying MMT as a new assembly site. Estimated Qualification Completion Date:June 2020
Statut du produit:
Microchip SST39SF010A-70-4I-NHE - Caractéristiques techniques
Memory Density: | 1Mb |
Memory Organization: | 128 K x 8 |
Supply Voltage-Nom: | 4.5V to 5.5V |
Access Time-Max: | 70ns |
Style d'emballage : | PLCC-32 |
Méthode de montage : | Surface Mount |
$Fonctionnalités et applications
CMOS Multi-Purpose Flash (MPF) manufactured with SST proprietary, high performance CMOS SuperFlash technology. The split-gate cell design and thick oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches. This device writes (Program or Erase) with a 4.5-5.5V power supply, and conforms to JEDEC standard pinouts for x8 memories.
Featuring high performance Byte-Program, provides a maximum Byte-Program time of 20 µsec (microsecond). Designed, manufactured, and tested for a wide spectrum of applications, these devices are offered with a guaranteed typical endurance of 10,000 cycles. Data retention is rated at greater than 100 years.
It is suited for applications that require convenient and economical updating of program, configuration, or data memory. For all system applications, they significantly improve performance and reliability, while lowering power consumption. They inherently use less energy during erase and program than alternative flash technologies. The total energy consumed is a function of the applied voltage, current, and time of application. Since for any given voltage range, the SuperFlash technology uses less current to program and has a shorter erase time, the total energy consumed during any Erase or Program operation is less than alternative flash technologies. This device also improves flexibility while lowering the cost for program, data, and configuration storage applications.
To meet high density, surface mount requirements, offered in 32-lead PLCC and 32-lead TSOP packages. A 600 mil, 32-pin PDIP is also available.
SST’s SST39SF010A-70-4I-NHE is a 1Mb (128k x 8), 70 nano second, 5 volt, 32 lead Plastic Lead Chip Carrier (PLCC) in an Industrial Temperature specification.
Emballages disponibles
Qté d'emballage(s) :
30 par Tube
Style d'emballage :
PLCC-32
Méthode de montage :
Surface Mount