Référence fabricant
PIC24FJ256GB210-I/PT
PIC24 Series 96 kB RAM 256 kB Flash 16-Bit Microcontroller SMT - TQFP-100
| | |||||||||||
| | |||||||||||
| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :119 par Tray Style d'emballage :TQFP-100 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip PIC24FJ256GB210-I/PT - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material and QMI519 as an additional die attach material for selected DSPIC33xx, PIC24EPxx, PIC32MXxx, PIC24FJxx, and PIC18F9xx device families available in 100L TQFP (12x12x1mm) package at MTAI assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material and QMI519 as an additional die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:15 January 2025 (date code: 253)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material and QMI519 as an additional die attach material for selected DSPIC33xx, PIC24EPxx, PIC32MXxx, PIC24FJxx, and PIC18F9xx device families available in 100L TQFP (12x12x1mm) package.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material and QMI519 as an additional die attach material.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Final Notice: Qualification of 100L TQFP (12x12x1mm) with 240x240 Lead-Frame Paddle size at ASAC (UDG) assembly site. Pre Change: Assembled at MTAI assembly site.Post Change: Assembled at MTAI and ASAC assembly sites.Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Statut du produit:
Microchip PIC24FJ256GB210-I/PT - Caractéristiques techniques
| Family Name: | PIC24F |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 256kB |
| RAM Size: | 96kB |
| Speed: | 32MHz |
| No of I/O Lines: | 84 |
| InterfaceType / Connectivity: | I2C/SPI/UART/USB |
| Peripherals: | Analog Comparators/I2C/On-Chip-ADC/PWM/SPI/UART/USB/Watchdog |
| Number Of Timers: | 5 |
| Supply Voltage: | 2.2V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 24-chx10-bit |
| Watchdog Timers: | 1 |
| Style d'emballage : | TQFP-100 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
PIC24FJ256GB210-I/PT is part of the PIC24F Series family with 256 kB Flash as a 16-Bit Flash Microcontroller.It can sustain standard temperature ranges from -40 to 125 and has 100 pin in a TQFP package. This device is lead free.
This is ideal for USB related applications that can benefit from the 16-bit MCU, USB, 96K byte RAM, and other peripherals.
Features:
- Universal Serial Bus Features:
- USB v2.0 On-The-Go (OTG) Compliant.
- Dual Role Capable – Can act as either Host or Peripheral.
- Low-Speed (1.5 Mbps) and Full-Speed (12 Mbps) USB Operation in Host mode.
- Full-Speed USB Operation in Device mode.
- Analog Features:
- Up to 24x, Capacitive touch sensing.
- Up to 24x, 10-Bit, ADC at 500 ksps.
- 3x Analog Comparators with Programmable Input/Output Configuration.
- Power Management:
- On-Chip Voltage Regulator of 1.8 V.
- Switch between Clock Sources in Real Time.
- Idle, Sleep and Doze modes with Fast Wake-up and Two-Speed Start-up.
- Run Mode: 800 uA/MIPS, 3.3 V Typical.
- Sleep mode Current Down to 20 uA, 3.3 V Typical.
- Standby Current with 32 kHz Oscillator: 22 uA, 3.3 V Typical.
To learn more about the PIC24FJ256GB210 product family, Click Here.
Emballages disponibles
Qté d'emballage(s) :
119 par Tray
Style d'emballage :
TQFP-100
Méthode de montage :
Surface Mount