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Livraison gratuite aux États-Unis continentaux à partir de 50 $ US. Des conditions s'appliquent
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MIC5801YWM
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31 par Tube
SOIC-24W
Surface Mount
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
UPDATE TO PCN 110887.Revision History: February 14, 2025: Issued initial notification.September 10, 2025: Issued final notification. Updated scope to remove MIC5200, MIC5201, MIC5202 device families and MIC5841YV-TR catalog part number and add 835-5043, LP2951, MIC2172, MIC2915x, MIC2920x, MIC2930xx, MIC2931x, MIC29371, MIC2941A, MIC29502, MIC2951, MIC2951x, MIC2954, MIC297xx, MIC2981, MIC3172, MIC37252, MIC37303, MIC3750x, MIC38C43, MIC38HC4x, MIC3915x, MIC3930x, MIC3950x, MIC3975, MIC457x, MIC501x, MIC502x, MIC5060, MIC515x, MIC580x and MIC58Pxx device families. Attached Qualification Report. Provided estimated first ship date to be on October 31, 2025.
Description of Change:Implementation of Inner Box, Reel and MSL Bag Label changes for virtually ALL Microchip products.Reason for Change:To improve productivity by implementing inner box, reel and MSL bag label changes.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: September 2025Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2 (TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
**FPCN97963 UPDATE**Revision History:May 10, 2023: Issued initial notification.June 21, 2024: Issued final notification. Attached the Qualification Report. Revised the Notification Subject to specify all affected device families. Provided estimated first ship date to be on July 19, 2024.Description of Change:Qualification of UNIG as an additional final test site for LM2574, LM2575, MIC2145, MIC2202, MIC2203, MIC2204, MIC2981, MIC4574, MIC4826, MIC4827, MIC4830, MIC4832, MIC4833, MIC5800, MIC5801, MIC5891, MIC58P01 and MIC59P50 device families available in Tube and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as an additional final test site.
Description of Change:Qualification of UNIG as an additional final test site for MIC2xxx, MIC4xxx, MIC5xxx and LM257xxx device families available in Tube and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as an additional final test site.
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Sur commande
Stock conservé dans l'entrepôt du fabricant. Sous réserve de disponibilité et de temps de transit.
