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Référence fabricant
APT2X60D60J
FRED D 600 V 600 A Dual Anti-Parallel ISOTOP
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :1 par Std. Mfr. Pkg | ||||||||||
| Code de date: | |||||||||||
Microchip APT2X60D60J - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change: Qualification of MCSO as an additional fabrication site for selected FRED 600V, FRED-400V, FRED-300V, FRED-200V, FRED-1200V and FRED-1000V device families available in various packages.Reason for Change: To improve productivity by qualifying MCSO as an additional fabrication site.Estimated Qualification Completion Date: October 2025
Description of Change:Qualification of MG15F-0140B as a new mold compound material for various products available in SOT-227, TO-264, TO-268 and TO-247 packages at TEAM assembly site.Reason for Change:To improve productivity by qualifying MG15F-0140B as a new mold compound material at TEAM assembly site.***Issued final notification. Provided estimated first ship date to be on June 29, 2024.
PCN Status:Final NotificationDescription of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in TO-264, SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound.Change Implementation Status:In ProgressEstimated First Ship Date:June 29, 2024 (date code: 2426)
PCN Status:Initial NotificationDescription of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in TO-264, SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound material at FSTS assembly site.
Description of Change:Qualification of MG15F-0140B as a new mold compound material for various products available in SOT-227, TO-264, TO-268 and TO-247 packages at TEAM assembly site.Reason for Change:To improve productivity by qualifying MG15F-0140B as a new mold compound material at TEAM assembly site.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=APT2X60D60J&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/it/p/semiconductors--various-parts-semiconductors/apt2x60d60j-microchip-C267800869
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- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=APT2X60D60J&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/it/p/semiconductors--various-parts-semiconductors/apt2x60d60j-microchip-C267800869
Emballages disponibles
Qté d'emballage(s) :
1 par Std. Mfr. Pkg