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Référence fabricant
PIC24FJ256GB110T-I/PF
PIC24F Series 256 kB Flash 16 kB RAM 16-Bit SMT Microcontroller - TQFP-100
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :1000 par Reel Style d'emballage :TQFP-100 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip PIC24FJ256GB110T-I/PF - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change: Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).Revision History:August 9, 2024: Issued initial notification.November 20, 2024: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 23, 2024.January 8, 2025: Re-issued to correct the pre and post table note from "66L" to "64L". Removed EOL CPNs PIC32MZ1024ECM100T-I/PF and PIC32MZ1024ECM100-I/PF from affected CPN list.
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
Description of Change:Qualification of new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT) for selected products available in 100L and 64L TQFP (14x14x1mm) packages at MMT assembly site.Reason for Change:To improve productivity by qualifying new stamped lead frame with inner lead tape and non-brown oxide treatment (non-BOT).
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire asnew wire material for selected DSPIC33FJ128xxx, DSPIC33FJ256xxx, DSPIC33FJxxGSxxx,DSPIC33FJxxMxxx, PIC18F9xJxx and PIC24FJxxxGxxx device families available in 64L and 100L TQFP(14x14x1 mm) package.Reason for Change:To improve manufacturability by qualifying palladium coated copper with goldflash (CuPdAu) bond wire.
Microchip has released a new Product Documents for the PIC24FJ256GB110 Family Silicon/Data Sheet Errata of devices. Notification Status: FinalDescription of Change:1) Added data sheet clarification issues 8 (Universal Serial Bus with On-The-Go Support (USB OTG)), 9 (Universal Serial Bus with On-The-Go Support (USB OTG)), 10 (Electrical Characteristics), 11 (Inter-integrated Circuit (I2C)) and 12 (Special Features).2) The USB OTG, SPI and I2C standards use the terminology ?Master? and ?Slave?. The equivalent Microchip terminology used in this document is ?Host? and ?Client?, respectively.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 09 Feb 2022
Statut du produit:
Microchip PIC24FJ256GB110T-I/PF - Caractéristiques techniques
| Family Name: | PIC24F |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 256kB |
| RAM Size: | 16kB |
| Speed: | 32MHz |
| No of I/O Lines: | 83 |
| InterfaceType / Connectivity: | I2C/SPI/UART/USART/USB OTG |
| Peripherals: | Brown-out Detect/LVD/POR/PWM/Reset/Watchdog |
| Supply Voltage: | 2V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 16-chx10-bit |
| Watchdog Timers: | 1 |
| Style d'emballage : | TQFP-100 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
1000 par Reel
Style d'emballage :
TQFP-100
Méthode de montage :
Surface Mount