Manufacturer Part #
SST26VF080A-104I/SN
SST26VF040A Series 8 Mbit 1M x 8 SPI Quad I/O 3 V 104MHz Flash Memory - SOIC-8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: |
Product Variant Information section
Available PackagingPackage Qty:100 per Tube Package Style:SOIC-8 Mounting Method:Surface Mount |
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Microchip SST26VF080A-104I/SN - Product Specification
Shipping Information:
HTS Code:
ECCN:
PCN Information:
*** Update of FPCN 119261 ***Revision History:February 23, 2026: Issued initial notification.February 26, 2026: Re-issued initial notification to include SOIJ package in the Notification subject.Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for selected SST26VF016B, SST26VF016BEUI, SST26VF032B, SST26VF032BA, SST26VF032BEUI, SST25VF080B, SST25VF040B, SST26WF064C, SST26VF064B, SST26VF064BA, SST26VF064BEUI, SST25VF020B, SST25PF020B, SST26VF080A, SST26VF040A, SST26VF020A, USBF8100, SST26WF080B, SST26WF080BA, SST26WF040B, SST26WF040BA, SST26WF016B and SST26WF016BA device families available in 8L SOIC and SOIJ (.208in and .150in) packages at MTAI assembly site.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material.Estimated Qualification Completion Date: April 2026
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach material for selected SST26VF016B, SST26VF016BEUI, SST26VF032B, SST26VF032BA, SST26VF032BEUI, SST25VF080B, SST25VF040B, SST26WF064C, SST26VF064B, SST26VF064BA, SST26VF064BEUI, SST25VF020B, SST25PF020B, SST26VF080A, SST26VF040A, SST26VF020A, USBF8100, SST26WF080B, SST26WF080BA, SST26WF040B, SST26WF040BA, SST26WF016B and SST26WF016BA device families available in 8L SOIC (.208in and .150in) packages at MTAI assembly site.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material and QMI519 as a new die attach materialEstimated Qualification Completion Date: April 2026
Part Status:
Microchip SST26VF080A-104I/SN - Technical Attributes
| Program Memory Type: | Flash |
| Clock Frequency-Max: | 104MHz |
| InterfaceType / Connectivity: | SPI - Quad I/O/SQI |
| Memory Density: | 8Mb |
| Memory Organization: | 512 K x 8 |
| Supply Voltage-Nom: | 2.7V to 3.6V |
| Temperature Grade: | Industrial |
| Operating Temp Range: | -40°C to +85°C |
| Storage Temperature Range: | -65°C to +150°C |
| Input Capacitance: | 6pF |
| Rise Time / Fall Time: | 3ns |
| NOR Serial Type: | Multi I/O, Quad |
| Moisture Sensitivity Level: | 3 |
| Package Style: | SOIC-8 |
| Mounting Method: | Surface Mount |
Features & Applications
Additional Features
• x1/x2/x4 Serial Peripheral Interface (SPI) Protocol and SQI protocol
• Burst Modes- Continuous linear burst, 8/16/32/64 Byte linear burst with wrap-around
• Page-Program- 256 Bytes per page in x1 or x4 mode
• Flexible Erase Capability- Uniform 4 KByte sectors, Uniform 32 KByte overlay blocks, Uniform 64 KByte overlay blocks
• Software Write Protection- Write protection through Block Protection bits in STATUS register
• Low Power Consumption: Active Read current: 15 mA (typical @ 104 MHz), Standby Current: 15 µA (typical), Deep Power-Down Current: 8uA (typical)
• SFDP (Serial Flash Discoverable Parameters)
• Packages Available: 8-contact WDFN (6mm x 5mm), 8-lead SOIC
• All devices are RoHS compliant
• Industrial -40C to +85C; Extended -40C to +125C
• Automotive AEC-Q100 Qualification Pending
Applications
The device’s high performance and reliability make it the ideal choice for Network Appliance, Smart Home, Wireless Connectivity, Computing, Digital TV, Smart Meter, Datacenter, Automotive and other Industrial applications.
Available Packaging
Package Qty:
100 per Tube
Package Style:
SOIC-8
Mounting Method:
Surface Mount