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Manufacturer Part #
MAX24288ETK2
Microchip MAX24288ETK2 - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Qualification of G700LA as a new mold compound material for selected MAX24x8x device family available in 68L WQFN (8x8x0.8mm) package assembled at ASCL assembly siteImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve manufacturability by qualifying G700LA as a new molding compound material.Change Implementation Status:In ProgressEstimated First Ship Date:January 20,2023 (date code: 2303)
PCN Status:Initial NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of G700LA as a new mold compound material for selected MAX24x8x device family available in 68L WQFN (8x8x0.8mm) package assembled at ASCL assembly site.Impacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve manufacturability by qualifying G700LA as a new molding compound material.Change Implementation Status:In ProgressEstimated Qualification Completion Date:July 2022
Part Status:
Available Packaging
Package Qty:
260 per Std. Mfr. Pkg