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Référence fabricant
APT50GT120B2RG
APT50GT120x Series 1200 V 94 A Flange Mount Thunderbolt IGBT® - TO-247-3
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :1 par Tube Style d'emballage :TO-247-3 Méthode de montage :Through Hole | ||||||||||
| Code de date: | |||||||||||
Microchip APT50GT120B2RG - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change: Qualification of Tin (Sn) as a new terminal plating for selected APL502, APL602, APT100, APT10M, APT11N, APT120, APT13G, APT150, APT15D, APT15G, APT200, APT20G, APT20M, APT25G, APT30D, APT30G, APT30M, APT30S, APT33G, APT35G, APT401, APT40D, APT40G, APT40M, APT45G, APT47N, APT501, APT502, APT50G, APT50M, APT601, APT602, APT603, APT60D, APT60M, APT60S, APT65G, APT75G, APT801, APT802, APT803, APT804, APT805, APT806, APT807, APT80G, APT94N, CC1105, CC1215, CC2515, CC3037, CC3038, CC3069 and CC3125 Microsemi Power Discrete TO-247 products.Reason for Change: To improve productivity by a change in terminal platingEstimated First Ship Date: 02 January 2026 (date code: 2601)
PCN Status:Final NotificationDescription of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in TO-264, SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound.Change Implementation Status:In ProgressEstimated First Ship Date:June 29, 2024 (date code: 2426)
PCN Status:Initial NotificationDescription of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in TO-264, SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound material at FSTS assembly site.
Description of Change:Qualification of INMK as a new fabrication site for selected APTGFxx, CMANGFxx, CMHSLGxx, MSCGLQxx, APT25Gxx, APT50Gxx, APT100xx, APT150xx, APT40Gxx, APT60Gxx, APT75Gxx and APT33Gxx device families available in 1200V Fast Switching Emitter Controlled Bare Die products.Reason for Change:To improve on-time delivery performance by qualifying INMK as a new fabrication site.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=APT50GT120B2RG&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/discretes--transistors--igbts/apt50gt120b2rg-microsemi-5034613
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=APT50GT120B2RG&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/discretes--transistors--igbts/apt50gt120b2rg-microsemi-5034613
Microchip APT50GT120B2RG - Caractéristiques techniques
| CE Voltage-Max: | 1200V |
| Collector Current @ 25C: | 94A |
| Power Dissipation-Tot: | 625W |
| Gate - Emitter Voltage: | ±30V |
| Pulsed Collector Current: | 150A |
| Turn-on Delay Time: | 24ns |
| Turn-off Delay Time: | 230ns |
| Qg Gate Charge: | 340nC |
| Leakage Current: | 300nA |
| Operating Temp Range: | -55°C to +150°C |
| No of Terminals: | 3 |
| Style d'emballage : | TO-247-3 |
| Méthode de montage : | Through Hole |
Emballages disponibles
Qté d'emballage(s) :
1 par Tube
Style d'emballage :
TO-247-3
Méthode de montage :
Through Hole