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Référence fabricant
5-534206-5
AMPMODU MOD II 10 Position Dual Row 2.54 mm Pitch Vertical Receptacle Assembly
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| Nom du fabricant: | TE Connectivity | ||||||||||
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Product Variant Information section
Emballages disponiblesQté d'emballage(s) :45 par Tube |
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TE Connectivity 5-534206-5 - Spécifications du produit
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
*** PCN Cancellation of PCN 113458 ***Product Description:MOD II & IV RECEPTACLE ASSEMBLYKind of Change:PCN CancellationGeneral Description of ChangesPlating optimization for MOD II & MOD IV Receptacle assembly. Before: (1) Current localized Gold Plating: 0.76 m(30 in) Au plating on contact area. (2) Current localized Gold Plating: 0.25 m(10 in) Au plating on contact area. After: (1) New localized Gold Plating: 0.66 m(26 in) PdNi+ 0.1 m(4 in) Au flash on contact area. (2) New localized Gold Plating: 0.15 m(6 in) PdNi+ 0.1 m(4 in) Au flash on contact area. Note: The Pd-Ni + Au flash plating has been validated for MOD II & MOD IV Receptacle assembly connector and test report is attached for reference.Reason for Cancellation:To ensure a smooth changeover and allow sufficient transition time to customer as requested.Remarks:1) The PdNi+Au flash plating implementation for the parts in PCN-25-246467 has been postponed to October 2026. 2) New PCN will be issued for the Pdni +Au flash Plating implementation.
Description of Change:Plating optimization for MOD II & MOD IV Receptacle assembly. Before: (1) Current localized Gold Plating: 0.76 m(30 in) Au plating on contact area. (2) Current localized Gold Plating: 0.25 m(10 in) Au plating on contact area. After: (1) New localized Gold Plating: 0.66 m(26 in) PdNi+ 0.1 m(4 in) Au flash on contact area. (2) New localized Gold Plating: 0.15 m(6 in) PdNi+ 0.1 m(4 in) Au flash on contact area. Note: The Pd-Ni + Au flash plating has been validated for MOD II & MOD IV Receptacle assembly connector and test report is attached for reference.Reason for Change:Product Improvement - Optimization of Plating for MOD II & MOD IV Receptacle assembly (Au plating to PdNi+Au ash plating)
Statut du produit:
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=5-534206-5&field4=TE Connectivity&field18=https://p1na.futureelectronics.com/fr/p/interconnect--connectors-pcb--socket-plug-board-mount/5-534206-5-te-connectivity-5561774
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=5-534206-5&field4=TE Connectivity&field18=https://p1na.futureelectronics.com/fr/p/interconnect--connectors-pcb--socket-plug-board-mount/5-534206-5-te-connectivity-5561774
Fonctionnalités et applications
The 5-534206-5 is a part of Board Connector Series with a burr-free lead-in and a receptacle contact featuring double cantilever beams and antioverstress stops, Its Operating temprature ranges from 65° C to +105° C
Product Features:
- Mod II
- 10 Positions
- Number of Rows = Dual
- Standard Profile
- PCB Mounting Orientation = Vertical
- PCB Mount Retention = With
- Termination Method to PC Board = Through Hole - Solder
- Closed Entry = With
- Board Standoff = With
- Contact - Rated Current (A) = 2
- Contact Resistance (m?) = 12
- Lead Free Solder Processes = Wave solder capable to 240°C
- Contact Base Material = Phosphor Bronze
- Packaging Method = Gang of Tubes
View the COmplete Series of Board to Board Receptacles
Emballages disponibles
Qté d'emballage(s) :
45 par Tube