
Manufacturer Part #
SY89295UTG
SY89295U Series 2.5V/3.3V 1.5 GHz Precision LVPECL Programmable Delay - TQFP-32
Microchip SY89295UTG - Product Specification
Shipping Information:
ECCN:
PCN Information:
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected SY8929xx, SY8770xx, SY8773xx, SY6975xx, SY8953xx, SY8772xx, SY100Exx, SY8922xx, SY8920xx, SY8983xx, SY8911xx, SY8947xx, SY8954xx, SY8985xx, SY8899xx, SY8923xx, SY8987xx, SY8984xx, SY8946xx, SY8971xx, SY8980xx, SY8814xx, SY8834xx, SYCUSTxx, SY8478xx, SY5585xx, SY5862xx, SY8893xx, SY8964xx, SY8921xx, SY8890xx, SY8931xx, SY8932xx, SY8877xx, SY8411xx, SY8830xx, SY8840xx and SY8835xx device families of 2DK technology available in various packages.Wafer Size changed from 8" to 6"Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.Estimated Qualification Completion Date: January 2026
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
**Update to previous FPCN 98050******Revise affected parts list to remove SY89829UHY, SY89829UHY-TR and SY55856UHG catalog part number since these parts were EOL?ed****Description of Change:Qualification of UNIG as a new final test site for various products available in Tube and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Description of Change: Qualification of MTAI as a new assembly site for selected SY100EP111, SY100EP195V, SY100EP196, SY89295U and SY89296 device families available in 32L TQFP (7x7x1.0mm) package.Reason for Change: To improve manufacturability by qualifying MTAI as a new assembly site.Change Implementation Status: In ProgressEstimated First Ship Date: August 19,2024 (date code: 2434)
Part Status:
Microchip SY89295UTG - Technical Attributes
Input Voltage-Max: | 4V |
Temperature Range: | -40°C to +85°C |
Supply Voltage-Nom: | 2.375V to 3.6V |
Frequency-Max: | 1.5GHz |
Package Style: | TQFP-32 |
Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
250 per Tray
Package Style:
TQFP-32
Mounting Method:
Surface Mount