Manufacturer Part #
MIC47050YMT-TR
LOW VIN SINGLE 500MA ADJUSTABLE LDO
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:5000 per Reel Package Style:TMLF-6 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MIC47050YMT-TR - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 111561 ***Revision History: March 20, 2025: Issued final notification.November 26, 2025: Re-issued final notification to correct the typo on Lead frame material from C164 to C194.Description of Change: Qualification of UNIS as an additional assembly site for MIC47050YMT-TR catalog part number (CPN) available in 6L UDFN (2x2x0.6mm) package.Reason for Change: To improve on-time delivery performance by qualifying UNIS as an additional assembly site.Estimated First Ship Date: 30 May 2025 (date code: 2522)
***UPDATE OF PCN113262***Description of Change: Qualification of UNIG as an additional final test location and scan and pack for MIC47050YMT-TR catalog part number (CPN) available in 6L UDFN (2x2x0.6mm) package.Reason for Change: To improve manufacturability and on-time delivery performance by qualifying UNIG as an additional final test site and scan and pack site.Estimated First Ship Date: 29 October 2025Revision History: May 29, 2025: Issued initial notification.October 10, 2025: Issued final notification.
*****FPCN111595 UPDATE/LOCATION CHANGE*****Description of Change:August 18, 2025: Issued final notification. Attached the Qualification Report. Provided the estimatedfirst ship date to be on October 29, 2025Fabrication Site:OLD- Microchip Technology Tempe ? Fab 2(TMGR)NEW- Microchip Technology Colorado (MCSO)Wafer SizeOLD- 8"NEW- 6"
Description of Change:Qualification of UNIG as an additional final test location and scan and pack for MIC47050YMT-TR catalog part number (CPN) available in 6L UDFN (2x2x0.6mm) package.Reason:To improve manufacturability and on-time delivery performance by qualifying UNIG as an additional final test site and scan and pack site.Estimated Qualification Completion Date: July 2025
Description of Change:Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected MIC18xx, MIC20xx, MIC23xx, MIC27xx, MIC28xx, MIC33xx, MIC47xx, MIC51xx, MIC53xx, MIC63xx, MIC80xx, MIC81xx, MIC82xx and MIC94xx device families available in various packages.Reason for Change:To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2025
Part Status:
Microchip MIC47050YMT-TR - Technical Attributes
| Input Voltage-Min: | 1V |
| Input Voltage-Max: | 3.6V |
| Output Voltage Range: | 0.4V to 2V |
| Dropout Voltage-Max: | 120mV |
| Output Current-Max: | 500mA |
| Rated Power: | 0.444W |
| Operating Temp Range: | -40°C to +125°C |
| Regulator Topology: | Adjustable |
| No. of Outputs: | Single |
| Output Noise: | 63µV |
| Load Regulation (%): | 0.5% |
| Current - Limit: | 2.5A |
| Line Regulation (%): | 0.05% |
| Package Style: | TMLF-6 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
5000 per Reel
Package Style:
TMLF-6
Mounting Method:
Surface Mount