
Manufacturer Part #
MCP1541T-I/TT
MCP1541 Series 4.3 to 5.5 V Supply SMT 4.096 V Voltage Reference SOT-23-3
Microchip MCP1541T-I/TT - Product Specification
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Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP9700B, MCP130, MCP9700, MCP9700A, TC1047A, TC1047, MCP102, MCP9701, MCP9701A, TCM808, MCP1525, MCP1541 device families available in 3L SOT-23 (1.3mm) package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated Qualification Completion Date: July 2025
Description of Change: Qualification of Microchip Technology Gresham – Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Part Status:
Microchip MCP1541T-I/TT - Technical Attributes
Type: | Series |
Reference Voltage: | 4.096V |
Tolerance (%): | ±1% |
Rated Current: | 20mA |
Rated Voltage: | 4.3V to 5.5V |
Forward (Drive) Current: | 8mA |
Quiescent Current: | 100µA |
Package Style: | SOT-23 (SC-59,TO-236) |
Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
3000 per Reel
Package Style:
SOT-23 (SC-59,TO-236)
Mounting Method:
Surface Mount