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Manufacturer Part #
TC1262-3.3VDB
TC1262 Series 500 mA Fixed Output CMOS LDO Regulator - SOT-223-3
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:78 per Tube Package Style:SOT-223 (TO-261-4, SC-73) Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2514 | ||||||||||
Microchip TC1262-3.3VDB - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 111024 ***Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: October 2025Revision History:February 21, 2025: Issued initial notificationMay 21, 2025: Re-issued to update the number of lots from 1 to 3 for ESD (HBM), ESD (CDM), and Latch-Up tests in the Qualification Plan. The affected CPN was also updated to include MCP1640CTI/MCVAO.
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file calledTempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: October 2025
PCN Status:Final NotificationDescription of Change:Qualification of HANA as an additional assembly site for selected MCP1703x, MCP182xx, TC1108, TC126x and TC2117 device families using 100x87 mils paddle size available in 3L SOT-223 package.Reason for Change:To improve on-time delivery performance by qualifying HANA as an additional assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:July 20, 2024 (date code: 2429)
Microchip has released a new Datasheet for the TC1262 Data Sheet of devices. If you are using one of these devices please read the document located at TC1262 Data Sheet.Notification Status: FinalDescription of Change: Revision D? Added automotive qualification to ?Features?.? Updated and added examples to ?Product Identification System?.? Updated ?Absolute Maximum Ratings?? to better describe the part.? Updated ?TC1262 Electrical Specifications?? Updated Section 6.0, Packaging Information.? Minor text and format changes throughout. Impacts to Data Sheet: See above detailsChange Implementation Status: CompleteDate Document Changes Effective: 10 Oct 2023NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
Description of Change:Qualification of HANA as an additional assembly site for selected MCP1703x, MCP182xx, TC1108, TC126x and TC2117 device families using 100x87 mils paddle size available in 3L SOT-223 package.Reason for Change:To improve on-time delivery performance by qualifying HANA as an additional assembly site.
Part Status:
Microchip TC1262-3.3VDB - Technical Attributes
| Type: | Low Dropout |
| Rated Voltage: | 2.7V to 6V |
| Package Style: | SOT-223 (TO-261-4, SC-73) |
| Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
78 per Tube
Package Style:
SOT-223 (TO-261-4, SC-73)
Mounting Method:
Surface Mount