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Manufacturer Part #
MTCH112T-I/MF
Proximity 2 Input, 1 Output, I2C Communication for Configuration 8 DFN 3x3x0.9mm
Microchip MTCH112T-I/MF - Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:November 20, 2020: Issued initial notification.January 29, 2021: Issued final notification. Provided estimated first ship date to be February 10, 2021.February 26, 2021: Reissued final notification. Included qual report attachment and updated qual report availability.Description of Change:Qualification of MMT as an additional assembly site for selected MTCH112, MTCH810 and PIC12xxxx device families available in 8L DFN (3x3x0.9mm) package.Pre Change:Assembled at NSEB using gold (Au) or palladium coated copper wire with gold flash (CuPdAu) bond wire, 8600 die attach material, EFTEC-64T lead frame or C194 lead frame material, Ag DAP surface prep or Bare Cu DAP surface prep and withoutlead lock lead frame.Post Change:Assembled at NSEB using gold (Au) or palladium coated copper wire with gold flash (CuPdAu) bond wire, 8600 die attach material, EFTEC-64T lead frame or C194 lead frame material, Ag DAP surface prep or Bare Cu DAP surface prep and without lead lock lead frameorAssembled at MMT using palladium coated copper wire with gold flash (CuPdAu) bond wire, 3280 die attach material, C194 lead frame material and Bare Cu DAP surface prep and with lead lock lead frame.Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.Estimated First Ship Date:February 10, 2021 (date code: 2107)
Revision History:November 20, 2020: Issued initial notification.January 29, 2021: Issued final notification. Provided estimated first ship date to be February 10, 2021.Description of Change:Qualification of MMT as an additional assembly site for selected MTCH112, MTCH810 and PIC12xxxx device families available in 8L DFN (3x3x0.9mm) package.Pre Change: Assembled at NSEB using gold (Au) or palladium coated copper wire with gold flash (CuPdAu) bond wire, 8600 die attach material, EFTEC-64T lead frame or C194 lead frame material, Ag DAP surface prep or Bare Cu DAP surface prep and without lead lock lead frame.Post Change:Assembled at NSEB using gold (Au) or palladium coated copper wire with gold flash (CuPdAu) bond wire, 8600 die attach material, EFTEC-64T lead frame or C194 lead frame material, Ag DAP surface prep or Bare Cu DAP surface prep and without lead lock lead frameorAssembled at MMT using palladium coated copper wire with gold flash (CuPdAu) bond wire, 3280 die attach material, C194 lead frame material and Bare Cu DAP surface prep and with lead lock lead frame.Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.Estimated First Ship Date: February 10, 2021 (date code: 2107)
Description of Change: Qualification of MMT as an additional assembly site for selected MITCH112. MITCH180, PIC10xxxx and PIC12xxxx products available in 8L DFN (3x3x0.9mm and 2x3x0.9mm) package.Pre Change:Assembled at NSEB using gold (Au) or palladium coated copper wire with gold flash (CuPdAu) bondwire, CRM1076DJ or 8600 die attach , G770HCD and G700LTD mold compound, EFTEC-64T or C194 lead frame material.Post Change:Assembled at NSEB using gold (Au) or palladium coated copper wire with gold flash (CuPdAu) bondwire, CRM1076DJ or 8600 die attach , G770HCD and G700LTD mold compound, EFTEC-64T or C194 lead frame material.Assembled at MMT using palladium coated copper wire with gold flash (CuPdAu) bondwire, 3280 die attach, G700LTD mold compound and C194 lead frame material.Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.Estimated Qualification Completion Date:January 2021
Part Status:
Microchip MTCH112T-I/MF - Technical Attributes
| Type: | Capacitive |
| Supply Voltage: | 1.8V to 3.3V |
| Supply Current: | 80mA |
| Interface: | I2C |
| Capacitance: | 40pF |
| Power Dissipation: | 800mW |
| Operating Temp Range: | -40°C to +85°C |
| Storage Temperature Range: | -65°C to +150°C |
| No of Terminals: | 8 |
| Package Style: | DFN-8 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
3300 per Std. Mfr. Pkg
Package Style:
DFN-8
Mounting Method:
Surface Mount