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Manufacturer Part #
MCP2515-I/SO
MCP2515 Series 5.5 V 1 Mb/s Stand Alone SPI Interface CAN Controller- SOIC-18
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:42 per Tube Package Style:SOIC-18 Mounting Method:Surface Mount | ||||||||||
| Date Code: | 1945 | ||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
Revision History:October 12, 2020: Issued initial notification.February 13, 2021: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on February 28, 2021.Description of Change:Qualification of QMI-519 die attach material for selected products available in 28L SOIC (.300in) and 18L SOIC (.300in) packages at MTAI assembly site.Pre Change:Using 3280 die attach materialPost Change:Using QMI-519 die attach materialPre and Post Change Summary: see attachedImpacts to Data Sheet: NoneChange Impact:NoneReason for Change:To improve productivity by qualifying QMI-519 die attach materialChange Implementation Status:In ProgressEstimated First Ship Date:February 28, 2021 (date code: 2110)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Time Table Summary: see attached
PCN Status: Initial notification. Description of Change: Qualification of QMI-519 die attach material for selected products available in 28L SOIC (.300in) and 18L SOIC (.300in) packages at MTAI assembly sitePre Change:Using 3280 die attach materialPost Change:Using QMI-519 die attach materialImpacts to Data Sheet: NoneChange Impact:NoneReason for Change:To improve productivity by qualifying QMI-519 die attach materialChange Implementation Status:In ProgressEstimated Qualification Completion Date:November 2020Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Revision History:October 12, 2020: Issued initial notification.
Description of Change:1) Added Exposed Thermal Pad description to Table 1-1.2) Updated Section 8.1 “Oscillator Start-up Timer”3) Updated Register 10-1.4) Updated Table 11-2.5) Updated Table 13-1 in Section 13.0 “Electrical Characteristics”.6) Updated the Product Identification System section.Reason for Change: To Improve ManufacturabilityDate Document Changes Effective: 29 Jan 2019NOTE: Please be advised that this is a change to the document only the product has not been changed.
Notification subject: CCB 3217 and CCB 3217.001 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products available in 18L and 28L SOIC package at MTAI assembly sitePCN Status:Final notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products available in 18L and 28L SOIC package at MTAI assembly sitePre Change: Using palladium coated copper wire (PdCu) bond wirePost Change: Using palladium coated copper with gold flash (CuPdAu) bond wireImpacts to Data Sheet: NoneChange Impact: NoneReason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) bond wireChange Implementation Status: In ProgressEstimated First Ship Date: September 16, 2018 (date code: 1838)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.Method to Identify Change: Traceability codeRevision History: March 08, 2018: Issued initial notification.August 16, 2018: Issued final notification. Attached the Qualification Report. Revised the affected parts list. Provided estimated first ship date on September 16, 2018. The change described in this PCN does not alter Microchip's
Initial Notice: Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 150K and 160K wafer technologies available in 18L SOICDescription of Change:Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 150K and 160K wafer technologies available in 18L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxyReason for Change:To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.
Part Status:
Technical Attributes
| Interface: | SPI |
| Data Rate-Max: | 1MBd |
| Supply Voltage-Nom: | 2.7V to 5.5V |
| Package Style: | SOIC-18 |
| Mounting Method: | Surface Mount |
Features & Applications
The MCP2515 series of stand-alone Controller Area Network (CAN) controller that implements the CAN specification, version 2.0B. It is capable of transmitting and receiving both standard and extended data and remote frames.
The MCP2515 has two acceptance masks and six acceptance filters that are used to filter out unwanted messages, thereby reducing the host MCUs overhead. The MCP2515 interfaces with microcontrollers (MCUs) via an industry standard Serial Peripheral Interface (SPI). It is pin and function compatible with the MCP2510 and also includes upgraded features like faster throughput, databyte filtering, and support for time-triggered protocols.
Features:
- 18-pin package
- Simple SPI interface to any MCU
- One-shot mode ensures message transmission is attempted only once
- Databyte filtering
- Start-of-Frame (SOF) output
Available Packaging
Package Qty:
42 per Tube
Package Style:
SOIC-18
Mounting Method:
Surface Mount
