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Manufacturer Part #
MCP2515-I/P
MCP2515 Series 5.5 V 1 Mb/s Stand Alone SPI Interface CAN Controller - PDIP-18
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:25 per Tube Package Style:PDIP-18 Mounting Method:Through Hole | ||||||||||
| Date Code: | |||||||||||
Microchip MCP2515-I/P - Product Specification
Shipping Information:
ECCN:
PCN Information:
Microchip has released a new Product Documents for the MCP2515 Stand-Alone CAN Controller with SPI Interface Data Sheet of devicesNotification Status: FinalDescription of Change: The following is the list of modifications:1. Added AEC-Q100 Qualified in Features. 2. Changed requirements from PS2 > SJW to PS2 � SJW in Section 5.5 �Programming Time Segments�.3. Updated Figure 12-8: TXREQ (TXB0CNTRL[3]) to TXREQ (TXB0CTRL[3]).4. Added the AEC-Q100 Automotive Qualification identification to the �Product Identification System�. 5. Several package drawings have been updated in Section 14.0 �Packaging Information�.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 22 Apr 2021NOTE: Please be advised that this is a change to the document only the product has not been changed.
Description of Change:Qualification of G600V as an additional/alternative mold compound material for selected products available in 8L, 14L, 16L, 18L, 20L, 28L, 40L PDIP and 28L SPDIP packages at MMT assembly site using gold (Au) wire.Pre Change:Using GE800 mold compound material.Post Change:Using GE800 mold compound material or using G600V mold compound material.Reason for Change:To improve on time delivery performance by qualifying G600V as an addition/alternative mold compound material for selected PDIP and SPDIP packages at MMT assembly site. Because of factory shutdowns due to the COVID-19 pandemic, we must quickly implement this change or risk not having material to ship. Estimated First Ship Date:April 30, 2020 (date code: 2018)
Description of Change:Qualification of G600V as an additional/alternative mold compound material for selected products available in 40L, 8L,14L, 16L, 18L, 20L, 28L PDIP and 28L SPDIP packages at MMT assembly site using palladium coated copper wire with gold flash (CuPdAu) bond wire.Pre Change:Using GE800 mold compound material.Post Change:Using GE800 or G600V mold compound material.Reason for Change:To improve on time delivery performance by qualifying G600V as an addition/alternative mold compound material for selected PDIP and SPDIP packages at MMT assembly site. Because of factory shutdowns due to the COVID-19 pandemic, we must quickly implement this change or risk not having material to ship.Estimated First Ship Date:April 30, 2020 (date code: 2018)
Part Status:
Microchip MCP2515-I/P - Technical Attributes
| Interface: | SPI |
| Data Rate-Max: | 1MBd |
| Supply Voltage-Nom: | 2.7V to 5.5V |
| Package Style: | PDIP-18 |
| Mounting Method: | Through Hole |
$Features & Applications
The MCP2515 series of stand-alone Controller Area Network (CAN) controller that implements the CAN specification, version 2.0B. It is capable of transmitting and receiving both standard and extended data and remote frames.
The MCP2515 has two acceptance masks and six acceptance filters that are used to filter out unwanted messages, thereby reducing the host MCUs overhead. The MCP2515 interfaces with microcontrollers (MCUs) via an industry standard Serial Peripheral Interface (SPI). It is pin and function compatible with the MCP2510 and also includes upgraded features like faster throughput, databyte filtering, and support for time-triggered protocols.
Features:
- 18-pin package
- Simple SPI interface to any MCU
- One-shot mode ensures message transmission is attempted only once
- Databyte filtering
- Start-of-Frame (SOF) output
- Low-power CMOS Technology
Available Packaging
Package Qty:
25 per Tube
Package Style:
PDIP-18
Mounting Method:
Through Hole
