
Manufacturer Part #
S25FL256SAGMFIR01
S25FL256S Series 256 Mb (32M x 8) 3 V SPI Serial Flash-NOR Memory - SOIC-16
Infineon S25FL256SAGMFIR01 - Product Specification
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Description:Change of wire bond from Cu to CuPdAu for industrial graded SOIC 16L packaged productsReason:Product harmonization of bond wire usage. CuPdAu wire enables superior electrical, thermal and reliability performance, making it an excellent interconnect solution for packaging to ensure business continuity and supply by streamlining its production.LTB - 2025-05-12LTS - 2025-08-12
Detailed change information:Change of lot naming convention in Infineon Technologies (Thailand) Limited, Nonthaburi, Thailand for subject memory productsReason:The lot numbering identification changing from 10 digit to 11 digit for whole Bangkok site according to the global Infineon standardlot numbering system manufacturing strategy.
Detailed change information:Change of lot naming convention in Infineon Technologies (Thailand) Limited, Nonthaburi, Thailand for subject memory productsReason:The lot numbering identification changing from 10 digit to 11 digit for whole Bangkok site according to the global Infineon standardlot numbering system manufacturing strategy.
Part Status:
Infineon S25FL256SAGMFIR01 - Technical Attributes
Program Memory Type: | Flash |
Clock Frequency-Max: | 133MHz |
InterfaceType / Connectivity: | Quad SPI/SPI - Quad I/O |
Memory Density: | 256Mb |
Memory Organization: | 32M x 8 |
Supply Voltage-Nom: | 2.7V to 3.6V |
Temperature Grade: | Industrial |
Operating Temp Range: | -40°C to +85°C |
Storage Temperature Range: | -65°C to +150°C |
Input Capacitance: | 8pF |
Moisture Sensitivity Level: | 3 |
Package Style: | SOIC-16 |
Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
47 per Tube
Package Style:
SOIC-16
Mounting Method:
Surface Mount