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Référence fabricant
SST26WF080B-104I/MF
8MB 1.8V SQI FLASH MEMORY
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :98 par Tube Style d'emballage :WDFN-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip SST26WF080B-104I/MF - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
PCN Status:Final NotificationDescription of Change:Qualification of NSEB and UTL3 as additional assembly sites for selected SST26WF016B, SST26WF016BA, SST26WF080B, SST26WF080BA, SST26WF040B, SST26WF040BA and SST26WF064C device families available in 8L TDFN-S (6x5x0.8mm) package.Reason for Change:To improve on-time delivery performance by qualifying UTL3 and NSEB as an additional assembly sites.Change Implementation Status:In Progress
PCN Status:Initial NotificationDescription of Change:Qualification of NSEB and UTL3 as additional assembly sites for selected SST26WF016B, SST26WF016BA, SST26WF080B, SST26WF080BA, SST26WF040B, SST26WF040BA and SST26WF064C device families available in 8L TDFN-S (6x5x0.8mm) package.Reason for Change:To improve on-time delivery performance by qualifying UTL3 and NSEB as an additional assembly sites.
Revision History:October 19, 2023: Issued initial notification.January 30, 2024: Issued cancellation notice.PCN Status:Cancellation NotificationMicrochip Parts Affected:This change would have affected products available in 8L TDFN-S (6x5x0.8mm) package.NOTE: For your convenience Microchip includes identical files in two formats (.pdf and .xls).Description of Change:This qualification was originally performed to qualify NSEB and UTL3 as an additional assembly site for selected SST26WF016Bxx, SST26WF040Bxx, SST26WF064C and SST26WF080Bxx device families available in 8L TDFN-S (6x5x0.8mm) package.Impacts to Data Sheet:Not applicable Change Impact:Not applicableReason for ChangeMicrochip has decided not to qualify NSEB and UTL3 as an additional assembly site for selected SST26WF016Bxx, SST26WF040Bxx, SST26WF064C and SST26WF080Bxx device families available in 8L TDFN-S (6x5x0.8mm) package.
Description of Change: Qualification of NSEB and UTL3 as an additional assembly sites for selected SST26WF016Bx, SST26WF040Bx, SST26WF064C and SST26WF080Bx device families available in 8L TDFN-S (6x5x0.8mm) package.Reason for Change: To improve on-time delivery performance by qualifying NSEB and UTL3 as additional assembly sites.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=SST26WF080B-104I/MF&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--memory--flash--norflash--serial/sst26wf080b-104i-mf-microchip-1062578
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=SST26WF080B-104I/MF&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--memory--flash--norflash--serial/sst26wf080b-104i-mf-microchip-1062578
Microchip SST26WF080B-104I/MF - Caractéristiques techniques
| Clock Frequency-Max: | 104MHz |
| Memory Density: | 8Mb |
| Supply Voltage-Nom: | 1.65V to 1.95V |
| Temperature Grade: | Industrial |
| Style d'emballage : | WDFN-8 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
98 par Tube
Style d'emballage :
WDFN-8
Méthode de montage :
Surface Mount