Free shipping within the continental US over $50. Conditions apply
Orders shipping outside of United States will be on hold while the company evaluates tariff impacts.Please contact your salesperson for assistance.
Manufacturer Part #
DSPIC33CK1024MP705-E/PT
100MHz,1024K Dual Panel Flash,128K RAM,CAN-FD,OpAmps,12bit ADCs,PWM
|
|
|||||||||||
|
|
|||||||||||
| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: |
Product Variant Information section
Available PackagingPackage Qty:250 per Tray |
||||||||||
| Date Code: | 2305 | ||||||||||
Microchip DSPIC33CK1024MP705-E/PT - Product Specification
Shipping Information:
HTS Code:
ECCN:
PCN Information:
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Microchip has released a new Errata for the dsPIC33CK1024MP710 Family Silicon Errata and Data Sheet Clarification of devices. If you are using one of these devices please read the document located at dsPIC33CK1024MP710 Family Silicon Errata and Data Sheet Clarification.Notification Status: FinalDescription of Change:- Added silicon errata issue 7 (Reset)Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 07 Jul 2023
Microchip has released a new Datasheet for the dsPIC33CK1024MP710 Family Data Sheet of devices.Description of Change:This revision incorporates the following updates:? Sections:? Changed Functional Safety Support ? ISO 26262/IEC 61508/IEC 60730 title and content.? Added new content to the first paragraph in 5.6.1 Flash Partition Swapping.? Added new paragraph to 12.2 Architecture Overview.? Added new paragraph to 30.6 Brown-out Reset (BOR). ? Added note to 30.7 Dual Watchdog Timer (WDT).? Tables:? Updated Table 1. dsPIC33CK1024MP710 Motor Control/Power Supply Families with CAN FD, Table 2. dsPIC33CK1024MP710 MotorControl/Power Supply Families with No CAN FD, Table 5. 80-Pin TQFP, Table 8-3. Remappable Pin Inputs, Table 8-5. Remappable OutputPin Registers, Table 8-6. Output Selection for Remappable Pins (RPn), Table 33-3. Thermal Operating Conditions, Table 33-36. UARTxModule I/O Timing Requirements, Table 33-39. DACx Module Specifications and Table 34-19. DACx Module Specifications.? Registers:? Updated 3.5.29 Y Page Register, 7.7.1 Interrupt Request Flags Register 0, 7.7.14 Interrupt Enable Register 0, 9.11.1 Oscillator ControlRegister, 11.2.1 CAN Control Register Low, 12.6.8 Auxiliary Combinational Trigger Register Low, 12.6.9 Auxiliary Combinational TriggerRegister High, 12.6.10 Auxiliary Combinatorial PWM Logic Control Register y, 12.6.19 Auxiliary PWM Generator xy PCI Register Low,12.6.20 Auxiliary PWM Generator xy PCI Register High, 12.6.22 Auxiliary PWM Generator x Leading-Edge Blanking Register High, 14.4.4DACx Control Low Register, 14.4.8 DAC Slope x Control Low Register, 22.6.1 CCPx Control 1 Low Register and 28.1.1 Deadman TimerControl Register.? Changes all instances of PWM, FSMINPER, PG, MPER, PGxPER, PGxPHASE, PGxCAP, PGxCON, PGxTRIG, PGxSTAT, PGxDCA in the AuxiliaryPWM section to APWM, AFSMINPER, APG, AMPER, APGxPER, APGxPHASE, APGxCAP, APGxCON, APGxTRIG, APGxSTAT, APGxDCA.? Figures:? Updated Figure 11-1. CAN FD Module Block Diagram.Reason for Change: To Improve Productivity.
Part Status:
-
https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=DSPIC33CK1024MP705-E/PT&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--microcontrollers--16-bit-digital-signal-controller-dsc/dspic33ck1024mp705-e-pt-microchip-8172516
-
https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=DSPIC33CK1024MP705-E/PT&field4=Microchip&field18=https://p1na.futureelectronics.com/p/semiconductors--microcontrollers--16-bit-digital-signal-controller-dsc/dspic33ck1024mp705-e-pt-microchip-8172516
Available Packaging
Package Qty:
250 per Tray