
Manufacturer Part #
PIC24FJ128GC010-I/PT
PIC24F Series 128 kB Flash 8 kB SRAM 32 MHz 16-Bit Microcontroller - TQFP-100
Microchip PIC24FJ128GC010-I/PT - Product Specification
Shipping Information:
ECCN:
PCN Information:
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material and QMI519 as an additional die attach material for selected DSPIC33xx, PIC24EPxx, PIC32MXxx, PIC24FJxx, and PIC18F9xx device families available in 100L TQFP (12x12x1mm) package at MTAI assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material and QMI519 as an additional die attach material.Change Implementation Status:In ProgressEstimated First Ship Date:15 January 2025 (date code: 253)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material and QMI519 as an additional die attach material for selected DSPIC33xx, PIC24EPxx, PIC32MXxx, PIC24FJxx, and PIC18F9xx device families available in 100L TQFP (12x12x1mm) package.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material and QMI519 as an additional die attach material.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Microchip has released a new Errata for the PIC24FG128GC010 Family Silicon Errata and Data Sheet Clarification of devices.Notification Status: FinalDescription of Change: Added silicon errata issue 8 (CTMU).Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 24 Nov 2022
Final Notice: Qualification of 100L TQFP (12x12x1mm) with 240x240 Lead-Frame Paddle size at ASAC (UDG) assembly site. Pre Change: Assembled at MTAI assembly site.Post Change: Assembled at MTAI and ASAC assembly sites.Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
Microchip PIC24FJ128GC010-I/PT - Technical Attributes
Family Name: | PIC24F |
Core Processor: | PIC |
Program Memory Type: | Flash |
Flash Size (Bytes): | 128kB |
RAM Size: | 8kB |
Speed: | 32MHz |
No of I/O Lines: | 85 |
InterfaceType / Connectivity: | IrDA/I2C/LIN/PMP/SPI/UART/USART/USB OTG |
Peripherals: | Brown-out Detect/LCD/LVD/POR/PWM/Reset/Watchdog |
Number Of Timers: | 5 |
Supply Voltage: | 2V to 3.6V |
Operating Temperature: | -40°C to +85°C |
On-Chip ADC: | 50-chx12-bit / 2-chx16-bit |
On-Chip DAC: | 2-chx10-bit |
Watchdog Timers: | 1 |
Package Style: | TQFP-100 |
Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
119 per Tray
Package Style:
TQFP-100
Mounting Method:
Surface Mount