

Manufacturer Part #
PIC16F18025-E/SL
14KB FLASH, 128EE, 1KB RAM, 10B
Microchip PIC16F18025-E/SL - Product Specification
Shipping Information:
ECCN:
PCN Information:
PCN Status:Final NotificationDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATTINY16x, ATTINY204, ATTINY214, ATTINY322, ATTINY4x, ATTINY8x, ABR16EB14, PIC16F131, PIC16F152, PIC16F171, PIC16F180 and PIC16F181 device families available in 14L SOIC (.150in) package at MTAI assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material at MTAI assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:14 November 2024 (date code: 2446)
***June 19, 2024: Reissued the initial notification to correct the typographical error in the Notification Subject***Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATTINY16x, ATTINY204, ATTINY214, ATTINY322, ATTINY4x, ATTINY8x, ABR16EB14, PIC16F131, PIC16F152, PIC16F171, PIC16F180 and PIC16F181 device families available in 14L SOIC (.150in) package at MTAI assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying palladiumcoated copper with gold flash (CuPdAu) as an additional bond wire material at MTAI assembly site.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATTINY16x, ATTINY204, ATTINY214, ATTINY322, ATTINY4x, ATTINY8x, ABR16EB14, PIC16F131, PIC16F152, PIC16F171, PIC16F180 and PIC16F181 device families available in 14L SOIC (.150in) package at MTAI assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) as an additional bond wire material at MTAI assembly site.
Microchip has released a new Document for the PIC16F18015/25/44/45 Family Silicon Errata and Datasheet Clarifications of devices.Description of Change: Updated data sheet revision letter to D.Impacts to Data Sheet: NoneReason for Change: To improve productivityChange Implementation Status: CompleteDate Document Changes Effective: 23 May 2024
Microchip has released a new Datasheet for the PIC16F18015/25/44/45 Full-Featured 8/14/20-Pin Microcontrollers of devices. Description of Change:Added Characterization graphs and updated electrical specifications.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 10 Apr 2024
Description of Change:Qualification of CuPdAu as an additional bond wire material for selected ATTINY16xx, ATTINY4xx, ATTINY2xx, ATTINY8xx, ATTINY3224 and PIC16F1xxxx device families available in 14L SOIC (.150in) package assembled at MTAI assembly site.Reason for Change:To improve manufacturability by qualifying CuPdAu as an additional bond wire material.
Microchip has released a new Errata for the PIC16F18015/25/44/45 Family Silicon Errata and Datasheet Clarifications of devices. If you are using one of these devices please read the document located at PIC16F18015/25/44/45 Family Silicon Errata and Datasheet Clarifications.Notification Status: FinalDescription of Change: Added silicon issue 1.1.1.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 12 Oct 2022NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices::N/A
Microchip has released a new Errata for the PIC16F18015/25/44/45 Family Silicon Errata and Datasheet Clarifications of devices. Notification Status: FinalDescription of Change: Adds silicon revision A2.Impacts to Data Sheet: NoneReason for Change: To improve productivityChange Implementation Status: CompleteEstimated First Ship Date: 30 July 2022
Part Status:
Available Packaging
Package Qty:
57 per Std. Mfr. Pkg