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Manufacturer Part #
PIC16LF18424-I/SL
8-bit Microcontrollers - MCU 7KB, 512B RAM, 2xPWMs, Comparator, DAC, 12-bit ADCC
Microchip PIC16LF18424-I/SL - Product Specification
Shipping Information:
ECCN:
PCN Information:
PCN Status:Cancellation NotificationReason for ChangeMicrochip has decided to not qualify palladium coated copper with gold flash (CuPdAu) bond wire material and 104x150 mils lead-frame paddle size for selected PIC16F153xx, PIC16F183xx, PIC16F184xx, PIC16LF15xx and PIC16LF18xx device families available in 14L SOIC (.150in) package.
PCN Status: Initial NotificationPCN Type:Manufacturing Change Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire as new wire material for selected PIC16F153xx, PIC16F183xx, PIC16F184xx, PIC16LF153xx, PIC16LF183xx, PIC16LF184xx, PIC18F04Q4xx, PIC18F05Q4xx and PIC18F06Q4xx device families available in 14L and 8L SOIC (3.90mm) package.Pre and Post Change Summary: See attachedImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2023Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Time Table Summary: See attached
Microchip has released a new Errata for the PIC16(L)F18424/44 Silicon Errata and Data Sheet Clarifications of devices.Notification Status: FinalDescription of Change: ? Split existing errata into two documents. This errata will continue to document issues with the PIC16(L)F18424/44 family and its data sheet (DS40002000). Silicon and data sheet issues for the PIC16(L)F18425/45 family (DS40002002) are now documented in Microchip errata DS80001067.? Added new Silicon Revision (A2)? Updated Table.1 - Silicon Device Identification? Added new errata: ? 1.1.2, Double Sample Conversions (ADCC) ? 1.1.3, ADC Conversion Acquisition Time in Sleep (ADCC) ? 1.2.1, Missing Codes with FVR Reference ? 1.3.1, The I2C Start and/or Stop Flags May Be Set When I2C Is Enabled ? 1.4.1, Low-Voltage Programming Not Possible ? 1.6.2, PFM Back to Back Writes ? 1.7.1, Wrong Duty Cycle for CCP Module ? 1.8.1, Reset Bit (SMT) ? 1.9.1, Synchronous Mode Transmissions (USART) ? 1.9.2, Double Byte Transmit (USART) B 11/2020 Added Silicon issue 1.2.2 for Electrical Spec; Other minorImpacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteEstimated First Ship Date: 21 December 2022
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire material and 104x150 mils lead-frame paddle size for selected PIC16F153xx, PIC16F183xx, PIC16F184xx, PIC16LF15xx and PIC16LF18xx device families available in 14L SOIC (.150in) package.Reason for Change:To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) bond wire material and 104x150 mils lead-frame paddle size.
Microchip has released a new Datasheet for the PIC16(L)F18424/44 14/20-Pin Full-Featured, Low Pin Count Microcontrollers Data Sheet of devicesNotification Status: FinalDescription of Change: Revision includes:? General improvement of the documentation and its structure? Added notes in the following sections: ? Section 18.3.2 Timer0 Output ? Section 19.7.6 Timer1 Gate Event Interrupt ? Section 32.1.1 Channel SelectionImpacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 26 Sep 2022
Microchip has released a new Product Documents for the PIC16(L)F18424/44 14/20-Pin Full-Featured Low Pin Count MCU with XLP Data Sheet of devices. Notification Status: FinalDescription of Change:1. General improvement of the documentation and its structure2. Updated terminology used throughout the data sheet:(a) Master is replaced by host(b) Slave is replaced by client3. Updated RSEL in the TxRST register4. Updated the ?Package Information? sectionImpacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 19 April 2022
Part Status:
Available Packaging
Package Qty:
57 per Std. Mfr. Pkg