
Manufacturer Part #
ATECC608C-MAHCZ-S
ATECC608C Series 5.5 V 1-Wire Interface Cryptographic Authentication IC - UDFN-8
Microchip ATECC608C-MAHCZ-S - Product Specification
Shipping Information:
ECCN:
PCN Information:
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
PCN Status:Final NotificationDescription of Change:Qualification of Microchip Technology Gresham – Fab 4 (GRTM) as an additional fabrication site for selected ATECC608C device family available in 8L SOIC (3.90mm), 8L UDFN (2x3x0.6mm) and 3L CONTACT (2.5x6.5x0.5mm) packages.Reason for Change:To improve on time delivery performance by qualifying Microchip Technology Gresham – Fab 4 (GRTM) as an additional fabrication site.Change Implementation Status:In ProgressEstimated First Ship Date:July 01, 2024 (date code: 2427)
Description of Change:Qualification of Microchip Technology Gresham – Fab 4 (GRTM) as an additional fabrication site for selected ATECC608C device family available in 8L SOIC (3.90mm), 8L UDFN (2x3x0.6mm) and 3L CONTACT (2.5x6.5x0.5mm) packages.Reason for Change:To improve on time delivery performance by qualifying Microchip Technology Gresham – Fab 4 (GRTM) as an additional fabrication site.
Part Status:
Microchip ATECC608C-MAHCZ-S - Technical Attributes
Frequency-Max: | 1MHz |
Supply Voltage: | 1.8V to 5.5V |
InterfaceType / Connectivity: | 1-Wire |
Operating Temp Range: | -40°C to +85°C |
Storage Temperature Range: | -65°C to +150°C |
Package Style: | UDFN-8 |
Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
3000 per Reel
Package Style:
UDFN-8
Mounting Method:
Surface Mount