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Manufacturer Part #
AT42QT1050-MMHR
5 CHANNEL QTCH ADC I2C T-SNSR IC
Microchip AT42QT1050-MMHR - Product Specification
Shipping Information:
ECCN:
PCN Information:
***Cancellation Notification***Description of Change:This qualification was originally performed to qualify Microchip Technology Gresham Fab 4 (GRTM) as an additional fabrication site for selected Atmel products.Reason for ChangeMicrochip has decided to not qualify Microchip Technology Gresham Fab 4 (GRTM) as an additional fabrication site for selected Atmel products.
PCN Status: Cancellation of notification.Reason for Change:Microchip has decided to not qualify NSEB as a new assembly site for selected ATTINY20, ATTINY40, AT42QT2120, AT42QT1070, AT42QT1050 Atmel device families available in 20L VQFN (3x3x0.85mm) package.Revision History:February 15, 2021: Issued initial notification.February 02, 2022: Issued cancellation notification.
Description of Change:Qualification of NSEB as a new assembly site for selected ATTINY20, ATTINY40, AT42QT2120, AT42QT1070, AT42QT1050 Atmel device families available in 20L VQFN (3x3x0.85mm) package.Pre Change:Assembled at ASKR using gold (Au) bond wire or palladium coated copper wire (PdCu) bond wire, EN-4900GC die attach material, C7025 lead frame material, NiPdAu lead frame lead plating, Spot plating lead frame DAP surface prep and without lead lock lead frame.Post Change:Assembled at NSEB using palladium coated copper with gold flash (CuPdAu) bond wire, 8600 die attach material, C194 lead frame material, Matte Sn lead frame lead plating, Ag on lead only lead frame DAP surface prep and with lead lock lead frame.Pre and Post Change Summary: see attachedImpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying NSEB as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:September 2021Note: Please be advised the qualification completion times may be extended because of unforeseen business conditions however implementation will not occur until after qualification has completed and a final PCN has been issued. The final PCN will include the qualification report and estimated first ship date. Also note that after the estimated first ship date guided in the final PCN customers may receive pre and post change parts.Time Table Summary:see attachedRevision History:February 15, 2021: Issued initial notification.The change described in this PCN does not alter Microchip’s current regulatory compliance regarding the material content of the applicable products.
PCN Status:Final notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of Microchip Technology Tempe Fab 2 (TMGR) as an additional fabrication site for selected Atmel products.Pre Change: Fabricated at Microchip Technology Colorado Fab 5 (MCSO) using 6 inch waferPost Change:Fabricated at Microchip Technology Colorado Fab 5 (MCSO) using 6 inch wafer or Microchip Technology Tempe Fab 2 (TMGR) using 8 inch waferImpacts to Data Sheet:None Change Impact:None Reason for Change:To improve manufacturability and on-time delivery performance by qualifying a second fabrication source at Microchip Technology Tempe Fab 2 (TMGR) fabrication site.Change Implementation Status:In Progress Estimated First Ship Date:January 11, 2021 (date code: 2103)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
PCN Status: Final notificationPCN Type: Manufacturing ChangeDescription of Change: Qualification of Microchip Technology Tempe Fab 2 (TMGR) as an additional fabrication site for selected Atmel products.Due to unforeseen circumstances, that are out of Microchip?s control, full qualification will be made available at a date after shipment as Microchip plans to continue fulfill orders by shipping from the new fabrication site as soon as possible as to not disrupt customer orders. Pre Change: Fabricated at Microchip Technology Colorado Fab 5 (MCSO) using 6 inch waferPost Change:Fabricated at Microchip Technology Colorado Fab 5 (MCSO) using 6 inch wafer or Microchip Technology Tempe Fab 2 (TMGR) using 8 inch wafer Impacts to Data Sheet: None Change Impact:None Reason for Change:To improve manufacturability and on-time delivery performance by qualifying a second fabrication source at Microchip Technology Tempe Fab 2 (TMGR) fabrication site.Due to unforeseen business conditions, Microchip Technology Tempe Fab 2 (TMGR) has been qualified as a additional fabrication site effective immediately. Change Implementation Status:In Progress Estimated First Ship Date:January 11, 2021 (date code: 2103)NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Part Status:
Available Packaging
Package Qty:
6000 per Std. Mfr. Pkg