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CUI Devices' line of high-performance thermoelectric cooling modules features an innovative arcTEC™ structure which delivers superior cooling performance and a longer cycle life.
CUI Devices' high-performance Peltier modules are available in a wide range of sizes and current ratings to meet the needs of various applications. They range in footprint size from the smallest at 20mm x 40mm to the largest at 50mm x 50mm, and have a profile as low as 3.15mm. The modules’ superior performance enables them to achieve a maximum temperature differential of up to 95°C.
CUI Devices Peltier modules: Maximum temperature differential of up to 95°C
The reliable solid-state construction, precise temperature control and quiet operation of these thermoelectric modules make them ideal for medical and industrial applications, and designs in which forced-air cooling is not possible.
The superior characteristics of these high-performance Peltier modules is due to CUI Devices' arcTEC structure, which combats the effects of thermal fatigue found in conventional thermoelectric modules by incorporating:
- A thermally conductive resin between the electrical interconnect and ceramic on the cold side of the module
- High-temperature solder
- Larger P/N semiconductor elements made from premium silicon ingot
The combination of these three enhancements greatly improves reliability, performance and cycle life.
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