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Manufacturer Part #
MCP1624T-I/CHY
500 KHZ, 150 MA SYN. BOOST, OUTPUT DISCONNECT & PWM/PFM ENABLED
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:3000 per Reel Package Style:SOT-23-6 (SOT-26) Mounting Method:Surface Mount | ||||||||||
| Date Code: | 2519 | ||||||||||
Microchip MCP1624T-I/CHY - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 116914 ***Revision History: February 21, 2025: Issued initial notificationMay 21, 2025: Re-issued to update the number of lots from 1 to 3 for ESD (HBM), ESD (CDM), and Latch-Up tests in the Qualification Plan. The affected CPN was also updated to include MCP1640CTI/MCVAO. Issued initial notification.October 22, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on November 28, 2025. Added a 'Change (Yes/No)' column to the Pre and Post Change Summary table. Revised affected parts list.October 28, 2025: Revised affected parts list.November 3, 2025: Re-issued final notification to update affected parts list to add MCP9700T H/TTVAO-VW catalog part number. Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 28 November 2025 (date code: 2548)
*** Update for PCN 116870 ***Revision History: February 21, 2025: Issued initial notificationMay 21, 2025: Re-issued to update the number of lots from 1 to 3 for ESD (HBM), ESD (CDM), and Latch-Up tests in the Qualification Plan. The affected CPN was also updated to include MCP1640CT-I/MCVAO. Issued initial notification.October 22, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on November 28, 2025. Added a 'Change (Yes/No)' column to the Pre and Post Change Summary table. Revised affected parts list.October 28, 2025: Revised affected parts list.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 28 November 2025 (date code: 2548)
** *UPDATE OF PCN111024 & PCN113243***Revision History: February 21, 2025: Issued initial notificationMay 21, 2025: Re-issued to update the number of lots from 1 to 3 for ESD (HBM), ESD (CDM), and Latch-Up tests in the Qualification Plan. The affected CPN was also updated to include MCP1640CT I/MCVAO. Issued initial notification.October 22, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on November 28, 2025. Added a 'Change (Yes/No)' column to the Pre and Post Change Summary table. Revised affected parts list.Description of Change: Qualification of Microchip Technology Gresham – Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.Estimated First Ship Date: 28 November 2025 (date code: 2548)
Description of Change:Revision E• Added automotive qualification to Features andexamples to Product Identification System.• Updated Figure 2-3, Figure 2-16, Figure 2-21,Figure 2-22, Figure 2-24 and added Figure 5-2:Recommended layout for DFN-8.• Updated Table 5-2: Recommended inductors.• Updated markings and layout in Section 6.0Reason for Change: To improve productivity
*** Update for PCN 111024 ***Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: October 2025Revision History:February 21, 2025: Issued initial notificationMay 21, 2025: Re-issued to update the number of lots from 1 to 3 for ESD (HBM), ESD (CDM), and Latch-Up tests in the Qualification Plan. The affected CPN was also updated to include MCP1640CTI/MCVAO.
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for selected MCP125x, MCP1602, MCP162x, MCP163x, MCP164x, MCP1726, MCP62x, MCP63x, MCP65x, MCP66x, MCP970x, TC101x, TC1047, TC105x, TC107x, TC110x, TC117x, TC118x, TC122x, TC126x, TC1272A, TC130xx, TC1313, TC2117, TC74, TCM80x, MCP1612, MCP6Vx and TCM810 device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file calledTempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: October 2025
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP1624T-I/CHY&field4=Microchip&field18=https://p1na.futureelectronics.com/de/p/semiconductors--analog--regulators-reference--switching-regulators/mcp1624t-i-chy-microchip-1108529
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP1624T-I/CHY&field4=Microchip&field18=https://p1na.futureelectronics.com/de/p/semiconductors--analog--regulators-reference--switching-regulators/mcp1624t-i-chy-microchip-1108529
Microchip MCP1624T-I/CHY - Technical Attributes
| Topology: | Boost |
| Input Voltage: | 0.8V to 5.5V |
| Output Current-Max: | 50mA |
| Output Voltage Range: | 2V to 5.5V |
| Switching Frequency-Max: | 630kHz |
| Operating Temp Range: | -40°C to +85°C |
| Duty Cycle-Max: | 90% |
| Efficiency: | 96% |
| No. of Outputs: | 1 |
| Quiescent Current: | 30µA |
| Storage Temperature Range: | -65°C to +150°C |
| Load Regulation (%): | 0.01% |
| Package Style: | SOT-23-6 (SOT-26) |
| Mounting Method: | Surface Mount |
Features & Applications
The MCP1624T-I/CHY is a compact, high-efficiency, fixed frequency and synchronous step-up DC-DC converter. Available in a SOT-23-6 package.
It provides an easy-to-use power supply solution for PIC microcontroller applications powered by either one-cell, two-cell, or three-cell alkaline, NiCd, NiMH, one-cell Li-Ion or Li-Polymer batteries.
Features:
- Up to 96% Typical Efficiency
- 425 mA Typical Peak Input Current Limit:
- IOUT > 50 mA @ 1.2 V VIN, 3.3 V VOUT
- IOUT > 175 mA @ 2.4 V VIN, 3.3 V VOUT
- IOUT > 175 mA @ 3.3 V VIN, 5.0 V VOUT
- Low Start-up Voltage: 0.65 V, typical 3.3 V VOUT @ 1 mA
- Low Operating Input Voltage: 0.35 V, typical 3.3 VOUT @ 1 mA
- Adjustable Output Voltage Range: 2.0 V to 5.5 V
- Maximum Input Voltage ≤ VOUT < 5.5 V
- Automatic PFM/PWM Operation (MCP1624)
- PWM-only Operation (MCP1623)
- 500 kHz PWM Frequency
- Low Device Quiescent Current: 19 μA, typical PFM mode
- Internal Synchronous Rectifier
- Internal Compensation
- Inrush Current Limiting and Internal Soft-Start
- True Load Disconnect
- Shutdown Current (All States): < 1 μA
- Low Noise, Anti-Ringing Control
- Overtemperature Protection
Applications:
- One, Two and Three Cell Alkaline and NiMH/NiCd Low-Power PIC® Microcontroller Applications
Available Packaging
Package Qty:
3000 per Reel
Package Style:
SOT-23-6 (SOT-26)
Mounting Method:
Surface Mount