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Référence fabricant
SIR870ADP-T1-GE3
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3000 par Reel
POWERPAK-SO-8
Surface Mount
Informations de livraison:
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Informations PCN:
Description of Change: To meet the increasing demand for commercial Power MOSFET products, Vishay Siliconix announces the qualification of wafer BGBM process (Backside-Grind and Backside-Metallization) for commercial Low-Voltage Power MOSFETs at in-house Siliconix Philippines Inc.(SPI) facility in Binan, Philippines.Reason for Change: Capacity Expansion
Description of Change: As part of Vishay Siliconix commitment to quality, we would like to extend to you a courtesy advisory notification of thedatasheet revision with Spirito SOA (Safe Operating Area) for the commercial MOSFET products, including SIJA22DP, SIR510DP, SIR5607DP,SIR870ADP, and SIR872ADP.There is no change to the materials used in the manufacture of this part. We hope you find this Datasheet Update Advisory helpful.This Advisory is for information only and there is no need for a response.Reason for Change: Datasheet Revision
Cancellation of Future PCN 98543Dear Valued Customer,Please be informed that PCN-SIL-018-2023-REV-1 has been withdrawn.REASON:10-6-23 Per Andrew Tsai: to correct the PCN subjectDescription of Change: To continue the supply of target commercial power MOSFETs, Vishay Siliconix announces the new solder paste, Pb95Sn5, is adopted in PowerPAK? SO-8 and SO-8 package to replace the original material, Pb88Sn10Ag2, for the yield improvement
Cancellation of Future PCN 98474Dear Valued Customer,Please be informed that PCN-SIL-018-2023-REV-0 has been withdrawn.REASON:10-6-23 Per Andrew Tsai: to correct the PCN subjectDescription of Change: To continue the supply of target commercial power MOSFETs, Vishay Siliconix announces the new solder paste, Pb95Sn5, is adopted in PowerPAK? SO-8 and SO-8 package to replace the original material, Pb88Sn10Ag2, for the yield improvement.
Vishay Siliconix Announces New Material of Solder Paste for Commercial Power MOSFETs in PowerPAK? SO-8 and SO-8 Package (update the subject of PCN-SIL-018-2023-REV-0)Description of Change: To continue the supply of target commercial power MOSFETs, Vishay Siliconix announces the new solder paste, Pb95Sn5, is adopted in PowerPAK? SO-8 and SO-8 package to replace the original material, Pb88Sn10Ag2, for the yield improvement.
Description of Change: To continue the supply of target commercial power MOSFETs, Vishay Siliconix announces the new solder paste, Pb95Sn5, is adopted in PowerPAK? SO-8 and SO-8 package to replace the original material, Pb88Sn10Ag2, for the yield improvement.
Description of Change: Due to the fire accident in Jan-2023, the original plating subcon of Vishay Siliconix, Welnew-Wuxi, is suspended and will be entirely replaced by the new site in Shanghai, China (Welnew-Shanghai). This full release of Welnew-Shnaghai applies to commercial product packages with copper lead-frame assembled in Simconix in Shanghai. Welnew-Shanghai was founded in 2006 as a leading provider of Hall sensor products, semiconductor process service, and equipments. Welnew-Shanghai has achieved the certifications, including IATF-16949, ISO-9001, and ISO-14001.Expected Influence on Quality/Reliability/Performance: There will be no effect on quality, reliability, performance, and the minimum/maximum values in the datasheet.Time Schedule:Start Shipment Date: Wed Jul 5, 2023
Statut du produit:
Sur commande
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