Référence fabricant
MCP6L4T-E/SL
MCP6L4 Series 6 V 2.8 MHz Rail-to-Rail I/O Operational Amplifier - SOIC-14
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :2600 par Std. Mfr. Pkg Style d'emballage :SOIC-14 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MCP6L4T-E/SL - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 120K and 121K wafer technologies available in 14L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxy or Gold wire and 8390A die attach epoxy.Reason for Change: To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Statut du produit:
Microchip MCP6L4T-E/SL - Caractéristiques techniques
| Amplifier Type: | General Purpose |
| No of Channels: | 4 |
| Slew Rate-Nom: | 2.3V/µs |
| Input Offset Voltage-Max: | 3mV |
| Gain Bandwidth Product: | 2.8MHz |
| Average Bias Current-Max: | 1pA |
| Supply Voltage: | 2.7V to 6V |
| Common Mode Rejection Ratio: | 90dB |
| Supply Current: | 200µA |
| Output Type: | Rail to Rail |
| Power Supply Rejection Ratio: | 90dB |
| Operating Temp Range: | -40°C to +125°C |
| DC Voltage Gain: | 105dB |
| Phase Margin: | 50° |
| Low Noise: | 21nV/√Hz |
| Output Current: | 20mA |
| Style d'emballage : | SOIC-14 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The MCP6L4 series of quad operational amplifier (op amp) has a gain bandwidth product of 2.8 MHz with low typical operating current of 200 µA.
The MCP6L4 uses Microchip's advanced CMOS technology, which provides low bias current, high-speed operation, high open-loop gain and rail-to-rail output swing. The MCP6L4 operates with a single supply voltage that can be as low as 2.7 V, while drawing less than 330 µA of quiescent current per amplifier. The MCP6L4 is available in standard 14-lead SOIC and TSSOP packages.
Features:
- Supply Voltage: 2.7 V to 6.0 V
- Rail-to-Rail Output
- Input Range Includes Ground
- Available in SOT-23-5 package
- Gain Bandwidth Product: 2.8 MHz (typical)
- Supply Current: IQ = 200 µA/amplifier (typical)
- Extended Temperature Range: -40°C to +125°C
Applications:
- Portable Equipment
- Photodiode Amplifier
- Analog Filters
- Data Acquisition
- Notebooks and PDAs
- Battery-Powered Systems
View the complete product family of MCP6Lx series Amplifiers
Emballages disponibles
Qté d'emballage(s) :
2600 par Std. Mfr. Pkg
Style d'emballage :
SOIC-14
Méthode de montage :
Surface Mount