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Référence fabricant
MCP6044T-I/SL
QUAD 1.6V 14 KHZ OP, I TEMP
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :2600 par Reel Style d'emballage :SOIC-14 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MCP6044T-I/SL - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 120K and 121K wafer technologies available in 14L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxy or Gold wire and 8390A die attach epoxy.Reason for Change: To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP6044T-I/SL&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--amplifiers--general-purpose/mcp6044t-i-sl-microchip-4010076
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP6044T-I/SL&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--amplifiers--general-purpose/mcp6044t-i-sl-microchip-4010076
Microchip MCP6044T-I/SL - Caractéristiques techniques
| Amplifier Type: | General Purpose |
| No of Channels: | 4 |
| Slew Rate-Nom: | 3V/ms |
| Input Offset Voltage-Max: | 3mV |
| Gain Bandwidth Product: | 14kHz |
| Average Bias Current-Max: | 1pA |
| Supply Voltage: | 1.4V to 6V |
| Common Mode Rejection Ratio: | 80dB |
| Output Type: | Rail to Rail |
| Power Supply Rejection Ratio: | 85dB |
| Operating Temp Range: | -40°C to +85°C |
| DC Voltage Gain: | 115dB |
| Phase Margin: | 65° |
| Low Noise: | 170nV/√Hz |
| Output Current: | 20mA |
| Style d'emballage : | SOIC-14 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
2600 par Reel
Style d'emballage :
SOIC-14
Méthode de montage :
Surface Mount