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Référence fabricant
MCP3021A5T-E/OT
Single Channel I2C Interface 5.5 V 22.3 kbps 10-Bit A/D Converter - SOT-23-5
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :3000 par Reel Style d'emballage :SOT-23-5 (SOT-25) Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2432 | ||||||||||
Microchip MCP3021A5T-E/OT - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
*** Update for PCN 115274 ***Revision History: August 15, 2025: Issued initial notification. October 28, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be November 17, 2025. Added a new column titled 'Change (Yes/No)' to the Pre and Post Change Summary table.Description of Change: Qualification of CRM-1151GA as a new die attach material for selected MCP1316, MCP1316M, MCP1317, MCP1318, MCP1318M, MCP1319, MCP1319M, MCP132x, MCP1824, MCP3021, MCP3221, MCP6001, MCP60x, MCP6021, MCP6231U, MCP6241U, MCP6271, MCP628x, MCP6291, MCP6401, MCP6401U, MCP6406, MCP6441, MCP654xU, MCP656x, MCP6G01, MCP6G01U, MCP6L01U, MCP6L1, MCP6L71, TC101x, TC105x, TC107x, TC118x, TC122x, TC201x, TC205x, TC218x and TC74 device families available in 5L & 6L SOT-23 packages at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.Estimated First Ship Date: 17 November 2025 (date code: 2547)
***UPDATE OF PCN113920***Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material for selected MCP18x, MCP60x, MCP61x, MCP6Lx, MCP13x, MCP32x, MCP30x, TC74, MCP65x, MCP64x, MCP62x, MCP6Gx, TC118x, TC101x, TC107x, TC105x, TC122x, TC201x, TC218x, and TC205x device families available in 5L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated First Ship Date: 19 August 2025 (date code: 2534)
Description of Change: Qualification of CRM-1151GA as a new die attach material for selected MCP1316, MCP1316M, MCP1317, MCP1318, MCP1318M, MCP1319, MCP1319M, MCP132x, MCP1824, MCP3021, MCP3221, MCP6001, MCP60x, MCP6021, MCP6231U, MCP6241U, MCP6271, MCP628x, MCP6291, MCP6401, MCP6401U, MCP6406, MCP6441, MCP654xU, MCP656x, MCP6G01, MCP6G01U, MCP6L01U, MCP6L1, MCP6L71, TC101x, TC105x, TC107x, TC118x, TC122x, TC201x, TC205x, TC218x and TC74 device families available in 5L & 6L SOT-23 packages at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material. Estimated Qualification Completion Date: September 2025
Description of Change: Qualification of CRM-1151GA as new die attach material for selected various device families available in 5L SOT-23 and 6L SOT-23 packages at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material for selected MCP18x, MCP60x, MCP61x, MCP6Lx, MCP13x, MCP32x, MCP30x, TC74, MCP65x, MCP64x, MCP62x, MCP6Gx, TC118x, TC101x, TC107x, TC105x, TC122x, TC201x, TC218x, and TC205x device families available in 5L SOT-23 package at MTAI assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Description of Change:Revision DFollowing is the list of changes for this revision:? Added AEC-Q100 Qualification to Features and General Description.? Added Related Devices.? Updated the temperature range from industrial (-40?C to +85?C) to extended (-40?C to +125?C), "Electrical Specifications"? Updated Product Identification System.? Added Product Identification System (Automotive).? Changed terminology:- Master device ? Host device- Slave device ? Client device? Several minor improvements to text formatting, parameter symbols and figures.? Updated Trademark, Legal Notice and Microchip Devices Code Protection Feature information. For details, refer to the Microchip Information page.? Removed Worldwide Sales and Service page.Reason for Change: To improve productivity
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected MCP13xx, MCP1824, MCP3021Axx, MCP3221Axx, MCP6xx, TC10xx,TC118xx, TC122xx, TC20xx, TC218xx and TC74Axx device families available in 6L and 5L SOT-23 packages assembled at MMT assembly site.Reason for Change:To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP3021A5T-E/OT&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--data-converters--analog-to-digital-converter/mcp3021a5t-e-ot-microchip-8003113
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP3021A5T-E/OT&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--data-converters--analog-to-digital-converter/mcp3021a5t-e-ot-microchip-8003113
Microchip MCP3021A5T-E/OT - Caractéristiques techniques
| Interface: | I2C |
| No of Channels: | 1 |
| Resolution: | 10b |
| Supply Voltage: | 2.7V to 5.5V |
| Sampling Rate: | 22.3kbps |
| Operating Temp Range: | -40°C to +125°C |
| Storage Temperature Range: | -65°C to +150°C |
| Style d'emballage : | SOT-23-5 (SOT-25) |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
Communication to the MCP3021 is performed using a 2-wire I2C™Compatible interface. Standard (100 kHz) and Fast (400 kHz) I2C™Compatible modes are available with the device. An on-chip conversion clock enables independent timing for the I2C™Compatible clock and the conversion clock. The device is also addressable allowing up to eight devices on a single 2-wire bus. The MCP3021 runs on a single supply voltage that operates over a broad range of 2.7 V to 5.5 V. This device also provides excellent linearity of ±1 LSB differential non-linearity and ±1 LSB integral non-linearity. Operating temperature range for this device is -40°C to +125°C.
Features:
- 10-bit resolution
- Single-ended input
- I2C™ interface
- Multiple address options
- ±1 LSB DNL
- ±1 LSB INL
- 22.3 ksps sample rate
- -40 to +125°C temperature range
- Small SOT-23 packaging
Applications:
- Sensor Interface
- Process Control
- Data Acquisition
- Battery Operated Systems
View the complete product family of MCP3021 series ADC
Emballages disponibles
Qté d'emballage(s) :
3000 par Reel
Style d'emballage :
SOT-23-5 (SOT-25)
Méthode de montage :
Surface Mount