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Manufacturer Part #
MCP14E11-E/MF
MCP14E Series '3.0 A Dual Complimentary Power MOSFET Driver - DFN8
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:60 per Tube Package Style:DFN-8 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Microchip MCP14E11-E/MF - Product Specification
Shipping Information:
ECCN:
PCN Information:
*** Update for PCN 110961 ***Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2(TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO ? Fab 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 30 September 2025 (date code: 2540)Revision History: February 19, 2025: Issued initial notification.September 04, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on September 30, 2025.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO ? Fab 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: July 2025Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2(TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
Part Status:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP14E11-E/MF&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--drivers--mosfet-igbt-drivers/mcp14e11-e-mf-microchip-7008746
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=en&field2=MCP14E11-E/MF&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--drivers--mosfet-igbt-drivers/mcp14e11-e-mf-microchip-7008746
Microchip MCP14E11-E/MF - Technical Attributes
| Configuration: | Low Side |
| No of Outputs: | Dual |
| Peak Output Current: | 3A |
| Supply Voltage-Max: | 18V |
| Package Style: | DFN-8 |
| Mounting Method: | Surface Mount |
Features & Applications
Features:
- High Peak Output Current: 3.0A (typical)
- Independent Enable Function for Each Driver Output
- Wide Input Supply Voltage Operating Range: 4.5 V to 18 V
- Low Shoot-Through/Cross-Conduction Current in Output Stage
- High Capacitive Load Drive Capability:
- tR: 14 ns with 1800 pF load (typical)
- tF: 17 ns with 1800 pF load (typical)
- Short Delay Times:
- tD1: 45 ns (typical)
- tD2: 45 ns (typical)
- Low Supply Current:
- With Logic ‘1’ Input/Enable – 1 mA (typical)
- With Logic ‘0’ Input/Enable – 300 μA (typical)
- Latch-up Protected: Passed JEDEC JESD78A
- Logic Input will Withstand Negative Swing, up to 5V
- Space-Saving Packages: 8-Lead SOIC, PDIP, 6x5 DFN
Applications:
- Switch Mode Power Supplies
- Pulse Transformer Drive
- Line Drivers
- Motor and Solenoid Drive
Available Packaging
Package Qty:
60 per Tube
Package Style:
DFN-8
Mounting Method:
Surface Mount