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Référence fabricant
TC1410NEOA
TC1410 Series 500 mA 16 Vmax Low Side Non-Inverting MOSFET Driver - SOIC-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :100 par Tube Style d'emballage :SOIC-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip TC1410NEOA - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 115157 ***Revision History: August 12, 2025: Issued initial notification. November 25, 2025: Issued final notification. Attached the qualification report. Provided estimated first ship date to be on December 15, 2025. Added column "Change (Yes/No)" in the pre and post change tableDescription of Change: Qualification of CRM-1151GA as new die attach material for selected MCP1404, MCP1406, MCP1407, MCP14E4, TC1410, TC1410N, TC1411, TC1411N, TC1412, TC1412N, TC1413, TC1413N, TC429, TC4420, TC4421A, TC4422A, TC4423A, TC4424A, TC4426A, TC4427, TC4427A, TC4429, TC4431, TC4432, TC4451 and TC4452 device families available in 8L SOIC (3.90mm) package at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.Estimated First Ship Date: 15 December 2025 (date code: 2551)
*** Update for PCN 115290 ***Revision History: August 13, 2025: Issued initial notification.November 13, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 24, 2025.Description of Change: Qualification of CRM-1151GA as new die attach material for selected MCP1403, MCP1404, MCP1405, MCP1406, MCP1407, MCP14E3, MCP14E4, MCP14E5, TC1410, TC1410N, TC1411, TC1411N, TC1412, TC1412N, TC1413, TC1413N, TC1426, TC1427, TC1428, TC426, TC427, TC428, TC429, TC4420, TC4421A, TC4422A, TC4423A, TC4424A, TC4425A, TC4426, TC4426A, TC4427, TC4427A, TC4428, TC4428A, TC4429, TC4431, TC4432, TC4451 and TC4452 available in 8L SOIC (3.90mm) package at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.Estimated First Ship Date: 24 December 2025 (date code: 2552)
*** Update for PCN 110961 ***Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2(TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO ? Fab 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 30 September 2025 (date code: 2540)Revision History: February 19, 2025: Issued initial notification.September 04, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on September 30, 2025.
Description of Change: Qualification of CRM-1151GA as new die attach material for selected MCP1403, MCP1404, MCP1405, MCP1406, MCP1407, MCP14E3, MCP14E4, MCP14E5, TC1410, TC1410N, TC1411, TC1411N, TC1412, TC1412N, TC1413, TC1413N, TC1426, TC1427, TC1428, TC426, TC427, TC428, TC429, TC4420, TC4421A, TC4422A, TC4423A, TC4424A, TC4425A, TC4426, TC4426A, TC4427, TC4427A, TC4428, TC4428A, TC4429, TC4431, TC4432, TC4451 and TC4452 available in 8L SOIC (3.90mm) package at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.Estimated Qualification Completion Date: September 2025
Description of Change: Qualification of CRM-1151GA as new die attach material for selected MCP1404, MCP1406, MCP1407, MCP14E4, TC1410, TC1410N, TC1411, TC1411N, TC1412, TC1412N, TC1413, TC1413N, TC429, TC4420, TC4421A, TC4422A, TC4423A, TC4424A, TC4426A, TC4427, TC4427A, TC4429, TC4431, TC4432, TC4451 and TC4452 device families available in 8L SOIC (3.90mm) package at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO ? Fab 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: July 2025Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2(TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=TC1410NEOA&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--drivers--mosfet-igbt-drivers/tc1410neoa-microchip-7824733
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=TC1410NEOA&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--drivers--mosfet-igbt-drivers/tc1410neoa-microchip-7824733
Microchip TC1410NEOA - Caractéristiques techniques
| Configuration: | Low Side |
| No of Outputs: | Single |
| Output Impedance: | 16Ω |
| Peak Output Current: | 0.5A |
| Supply Voltage-Max: | 16V |
| Style d'emballage : | SOIC-8 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The TC1410NEOA is a 16 V 500 mA High-Speed and Low Side Non-Inverting MOSFET Driver, available in SOIC-8 package.
Features:
- Latch-Up Protected: Will Withstand 500 mA Reverse Current
- Input Will Withstand Negative Inputs Up to 5 V
- ESD Protected: 4 kV
- High Peak Output Current: 0.5 A
- Wide Input Supply Voltage Operating Range:
- 4.5V to 16V
- High Capacitive Load Drive Capability:
- 500 pF in 25 nsec
- Short Delay Time: 30 nsec Typ.
- Consistent Delay Times With Changes in Supply Voltage
- Matched Delay Times
- Low Supply Current
- With Logic 1 Input: 500 µA
- With Logic 0 Input: 100 µA
- Low Output Impedance: 16Ω
- Available in Space-Saving 8-pin MSOP Package
Applications:
- Switch Mode Power Supplies
- Line Drivers
- Pulse Transformer Drive
- Relay Driver
Emballages disponibles
Qté d'emballage(s) :
100 par Tube
Style d'emballage :
SOIC-8
Méthode de montage :
Surface Mount