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Référence fabricant
TC1426COA
TC1426 Series 1.2 A 16 Vmax Dual Low Side Inverting MOSFET Driver - SOIC-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :100 par Tube Style d'emballage :SOIC-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip TC1426COA - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 115290 ***Revision History: August 13, 2025: Issued initial notification.November 13, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 24, 2025.Description of Change: Qualification of CRM-1151GA as new die attach material for selected MCP1403, MCP1404, MCP1405, MCP1406, MCP1407, MCP14E3, MCP14E4, MCP14E5, TC1410, TC1410N, TC1411, TC1411N, TC1412, TC1412N, TC1413, TC1413N, TC1426, TC1427, TC1428, TC426, TC427, TC428, TC429, TC4420, TC4421A, TC4422A, TC4423A, TC4424A, TC4425A, TC4426, TC4426A, TC4427, TC4427A, TC4428, TC4428A, TC4429, TC4431, TC4432, TC4451 and TC4452 available in 8L SOIC (3.90mm) package at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.Estimated First Ship Date: 24 December 2025 (date code: 2552)
*** Update for PCN 110961 ***Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2(TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO ? Fab 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 30 September 2025 (date code: 2540)Revision History: February 19, 2025: Issued initial notification.September 04, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on September 30, 2025.
Description of Change: Qualification of CRM-1151GA as new die attach material for selected MCP1403, MCP1404, MCP1405, MCP1406, MCP1407, MCP14E3, MCP14E4, MCP14E5, TC1410, TC1410N, TC1411, TC1411N, TC1412, TC1412N, TC1413, TC1413N, TC1426, TC1427, TC1428, TC426, TC427, TC428, TC429, TC4420, TC4421A, TC4422A, TC4423A, TC4424A, TC4425A, TC4426, TC4426A, TC4427, TC4427A, TC4428, TC4428A, TC4429, TC4431, TC4432, TC4451 and TC4452 available in 8L SOIC (3.90mm) package at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.Estimated Qualification Completion Date: September 2025
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO ? Fab 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: July 2025Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2(TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
Cancellation Notification:Description of Change:This qualification was originally performed to qualify a new lead frame design for selected products available in 8L SOIC package using 8900NC die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=TC1426COA&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--drivers--mosfet-igbt-drivers/tc1426coa-microchip-7939606
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=TC1426COA&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--drivers--mosfet-igbt-drivers/tc1426coa-microchip-7939606
Microchip TC1426COA - Caractéristiques techniques
| Configuration: | Low Side |
| No of Outputs: | Dual |
| Output Impedance: | 8Ω |
| Peak Output Current: | 1.2A |
| Supply Voltage-Max: | 16V |
| Style d'emballage : | SOIC-8 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The TC1426COA is a 16 V, 500 mA High-Speed and Dual Low Side Inverting MOSFET Driver, available in SOIC-8 package.
Features:
- Low Cost
- Latch-Up Protected: Will Withstand 500 mA Reverse Output Current
- ESD Protected ±2kV
- High Peak Output Current: 1.2A
- Wide Operating Range: 4.5V to 16V
- High Capacitive Load Drive Capability: 1000 pF in 38 nsec
- Low Delay Time: 75 nsec Max
- Logic Input Threshold Independent of Supply Voltage
- Output Voltage Swing to Within 25 mV of Ground or VDD
- Low Output Impedance: 8Ω
Applications:
- Power MOSFET Drivers
- Switched Mode Power Supplies
- Pulse Transformer Drive
- Small Motor Controls
- Print Head Drive
Emballages disponibles
Qté d'emballage(s) :
100 par Tube
Style d'emballage :
SOIC-8
Méthode de montage :
Surface Mount