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Référence fabricant
TC426COA
TC426 Series 1.5 A 18 Vmax Dual Low Side Inverting MOSFET Driver - SOIC-8
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :100 par Tube Style d'emballage :SOIC-8 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2505 | ||||||||||
Microchip TC426COA - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 115290 ***Revision History: August 13, 2025: Issued initial notification.November 13, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on December 24, 2025.Description of Change: Qualification of CRM-1151GA as new die attach material for selected MCP1403, MCP1404, MCP1405, MCP1406, MCP1407, MCP14E3, MCP14E4, MCP14E5, TC1410, TC1410N, TC1411, TC1411N, TC1412, TC1412N, TC1413, TC1413N, TC1426, TC1427, TC1428, TC426, TC427, TC428, TC429, TC4420, TC4421A, TC4422A, TC4423A, TC4424A, TC4425A, TC4426, TC4426A, TC4427, TC4427A, TC4428, TC4428A, TC4429, TC4431, TC4432, TC4451 and TC4452 available in 8L SOIC (3.90mm) package at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.Estimated First Ship Date: 24 December 2025 (date code: 2552)
*** Update for PCN 110961 ***Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2(TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO ? Fab 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 30 September 2025 (date code: 2540)Revision History: February 19, 2025: Issued initial notification.September 04, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on September 30, 2025.
Description of Change: Qualification of CRM-1151GA as new die attach material for selected MCP1403, MCP1404, MCP1405, MCP1406, MCP1407, MCP14E3, MCP14E4, MCP14E5, TC1410, TC1410N, TC1411, TC1411N, TC1412, TC1412N, TC1413, TC1413N, TC1426, TC1427, TC1428, TC426, TC427, TC428, TC429, TC4420, TC4421A, TC4422A, TC4423A, TC4424A, TC4425A, TC4426, TC4426A, TC4427, TC4427A, TC4428, TC4428A, TC4429, TC4431, TC4432, TC4451 and TC4452 available in 8L SOIC (3.90mm) package at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.Estimated Qualification Completion Date: September 2025
Description of Change:Microchip has released a new Datasheet for the TC426/TC427/TC428 - 1.5A Dual High-Speed Power MOSFET Drivers of devices.Revision E? Update Features, General Description and Section 3.4, Power Dissipation.? Added MSOP package information throughout the document.? Updated measurement unit in Section 4.0 ?Typical Characteristics?, graphic ?Supply Voltage vs. Quiescent Supply Current?, No load, Both Inputs Logic ?0?.? Updated Section 5.0 ?Packaging Information? by adding Package Markings Information and Package Outline Drawings.? Removed Device Selection Table and added Section ?Product Identification System?.? Minor text and format changes throughout.Reason for Change: To improve productivity.Date Document Changes Effective: 23 Jun 2025
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO ? Fab 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: July 2025Pre and Post Summary Changes:? Pre Change: Fabrication Site = Microchip Technology Tempe ? Fab 2(TMGR), Wafer Size = 8"? Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
Cancellation Notification:Description of Change:This qualification was originally performed to qualify a new lead frame design for selected products available in 8L SOIC package using 8900NC die attach and palladium coated copper with gold flash (CuPdAu) bond wire material assembled at MMT assembly site.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=TC426COA&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--drivers--mosfet-igbt-drivers/tc426coa-microchip-9061086
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=TC426COA&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--analog--drivers--mosfet-igbt-drivers/tc426coa-microchip-9061086
Microchip TC426COA - Caractéristiques techniques
| Configuration: | Low Side |
| No of Outputs: | Dual |
| Output Impedance: | 6Ω |
| Peak Output Current: | 1.5A |
| Supply Voltage-Max: | 18V |
| Style d'emballage : | SOIC-8 |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The TC426COA is a 18 V and 1.5 A Dual High-Speed Power MOSFET Driver, available in SOIC-8 package.
Features:
- High-Speed Switching (CL = 1000pF): 30nsec
- High Peak Output Current: 1.5A
- High Output Voltage Swing
- VDD -25mV
- GND +25mV
- Low Input Current (Logic "0" or "1"): 1μA
- TTL/CMOS Input Compatible
- Available in Inverting and Noninverting Configurations
- Wide Operating Supply Voltage : 4.5V to 18V
- Current Consumption
- Inputs Low – 0.4mA
- Inputs High – 8mA
- Single Supply Operation
- Low Output Impedance: 6Ω
- Latch-Up Resistant: Withstands > 500mA Reverse Current
- ESD Protected: 2kV
Applications:
- Switch Mode Power Supplies
- Pulse Transformer Drive
- Clock Line Driver
- Coax Cable Driver
Emballages disponibles
Qté d'emballage(s) :
100 par Tube
Style d'emballage :
SOIC-8
Méthode de montage :
Surface Mount