Référence fabricant
APT80GA60LD40
IGBT,600V, 143A, 625W, TO264
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: |
Product Variant Information section
Emballages disponiblesQté d'emballage(s) :25 par Tube Style d'emballage :TO-264 Méthode de montage :Through Hole |
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Microchip APT80GA60LD40 - Spécifications du produit
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
PCN Status:Final NotificationDescription of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in TO-264, SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound.Change Implementation Status:In ProgressEstimated First Ship Date:June 29, 2024 (date code: 2426)
PCN Status:Initial NotificationDescription of Change:Qualification of MG15F-35AB and MG15F-0140B as a new mold compound material for various products available in TO-264, SOT-227 and TO-247 packages at FSTS assembly site.Reason for Change:To improve productivity by qualifying MG15F-35AB and MG15F-0140B as a new mold compound material at FSTS assembly site.
Statut du produit:
Microchip APT80GA60LD40 - Caractéristiques techniques
| CE Voltage-Max: | 600V |
| Collector Current @ 25C: | 143A |
| Power Dissipation-Tot: | 625W |
| Gate - Emitter Voltage: | 30V |
| Pulsed Collector Current: | 240A |
| Collector - Emitter Saturation Voltage: | 2V |
| Turn-on Delay Time: | 23ns |
| Turn-off Delay Time: | 158ns |
| Qg Gate Charge: | 230nC |
| Reverse Recovery Time-Max: | 22ns |
| Leakage Current: | 100nA |
| Input Capacitance: | 6390pF |
| Thermal Resistance: | 0.2°C/W |
| Operating Temp Range: | -55°C to +150°C |
| No of Terminals: | 3 |
| Style d'emballage : | TO-264 |
| Méthode de montage : | Through Hole |
Emballages disponibles
Qté d'emballage(s) :
25 par Tube
Style d'emballage :
TO-264
Méthode de montage :
Through Hole