
Référence fabricant
25LC160BT-E/ST
25LC160B Series 16 Kbit (2K x 8) 5.5 V SMT SPI Bus Serial EEPROM - TSSOP-8
Microchip 25LC160BT-E/ST - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
PCN Status:Final NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products available in 8L TSSOP (4.4mm) package assembled at MMT assembly site.Impacts to Data Sheet:NoneReason for Change:To improve on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Change Implementation Status:In ProgressEstimated First Ship Date:March 17, 2022 (date code: 2212)
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire for selected products available in 8L TSSOP (4.4mm) package assembled at MMT assembly site.Reason for Change:To improve on-time delivery performance by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.
Statut du produit:
Microchip 25LC160BT-E/ST - Caractéristiques techniques
Style d'emballage : | TSSOP-8 |
Méthode de montage : | Surface Mount |
Fonctionnalités et applications
Emballages disponibles
Qté d'emballage(s) :
2500 par Cut Tape
Style d'emballage :
TSSOP-8
Méthode de montage :
Surface Mount