Microchip | SST39VF800A-70-4C-B3KE

NOTE: This SST product is migrating to the preferred Microchip (MCP) part number. All products bearing the Microchip part number are identical in form, fit and function to the products with the legacy SST prefix/logo mark.

The SST39VF800A-70-4C-B3KE is a part of SST39VF Series Multi-Purpose Flash Plus. It has an standard operating temperature ranging from  -40°C to +85°C, it comes in TFBGA-48 package.

The SST39VF800A is a 512K x16 CMOS Multi-Purpose Flash (MPF) manufactured with proprietary, high performance CMOS SuperFlash technology. The split-gate cell design and thick oxide tunneling injector attain better reliability and manufacturability compared with alternate approaches.
 
Features:

• Organized as 512K x16
• Single Voltage Read and Write Operations: 2.7-3.6 V
• Superior Reliability
• Endurance: 100,000 Cycles (typical)
• Greater than 100 years Data Retention
• Low Power Consumption (typical values at 14 MHz)
• Active Current: 9 mA (typical)
• Standby Current: 3 µA (typical)
• Sector-Erase Capability
• Uniform 2 KWord sectors
• Block-Erase Capability
• Uniform 32 KWord blocks
• Fast Read Access Time: 70 ns
• Latched Address and Data
• Fast Erase and Word-Program
• Sector-Erase Time: 18 ms (typical)
• Block-Erase Time: 18 ms (typical)
• Chip-Erase Time: 70 ms (typical)
• Word-Program Time: 14 µs (typical)
• Chip Rewrite Time: 8 seconds (typical)
• Automatic Write Timing
• Internal VPP Generation
• End-of-Write Detection
• Toggle Bit
• Data# Polling
• CMOS I/O Compatibility
• JEDEC Standard
• Flash EEPROM Pinouts and command sets
• Packages Available
• 48-lead TSOP (12mm x 20mm)
• 48-ball TFBGA (6mm x 8mm)
• 48-ball WFBGA (4mm x 6mm)
• 48-bump XFLGA (4mm x 6mm) – 4 and 8Mbit
• All non-Pb (lead-free) devices are RoHS compliant

View the complete SST39VF Series of Multi-Purpose Flash