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Référence fabricant
PIC24FJ256GA702-I/SP
PIC24F Series 256kB Flash 16 kB RAM Through Hole 16-Bit Microcontroller-SPDIP-28
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :15 par Tube Style d'emballage :SPDIP-28 Méthode de montage :Through Hole | ||||||||||
| Code de date: | 1636 | ||||||||||
Microchip PIC24FJ256GA702-I/SP - Spécifications du produit
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Informations PCN:
Microchip has released a new Product Documents for the PIC24FJ256GA705 Family Silicon Errata and Data Sheet Clarification of devices.Description of Change:1. Removed A5 from the Affected Silicon Revisions table in silicon errata issue 4 (Primary XT and HS Oscillator (POSC) because this issue only affects silicon revisions A3 and A4.2. The I2C standard uses the terminology Master and Slave. The equivalent Microchip terminology used in this document is Host and Client, respectively. Reason for Change: To Improve Productivity Date Document Changes Effective: 11 March 2021NOTE: Please be advised that this is a change to the document only the product has not been changed.
Description of Change: 1) Added silicon errata issues 17 (Oscillator), 18 (CCP), 19 (Oscillator), 20 (Oscillator), 21 (I 2C) and 22 (I 2C). 2) Removed data sheet clarifications 2 (Flash Program Memory), 3 (Memory Organization) and 4 (Capture/ Compare/PWM/Timer Modules (MCCP)) because these were corrected in the current device data sheet. 3) Added data sheet clarification 2 (Oscillator)NOTE: Please be advised that this is a change to the document only the product has not been changed.
Description of Change:Qualification of G600V as an additional/alternative mold compound material for selected products available in 8L, 14L, 16L, 18L, 20L, 28L, 40L PDIP and 28L SPDIP packages at MMT assembly site using gold (Au) wire.Pre Change:Using GE800 mold compound material.Post Change:Using GE800 mold compound material or using G600V mold compound material.Reason for Change:To improve on time delivery performance by qualifying G600V as an addition/alternative mold compound material for selected PDIP and SPDIP packages at MMT assembly site. Because of factory shutdowns due to the COVID-19 pandemic, we must quickly implement this change or risk not having material to ship. Estimated First Ship Date:April 30, 2020 (date code: 2018)
Data Sheet - PIC24FJ256GA705 Family Data SheetTop of Form 1Notification Status: FinalDescription of Change: This revision incorporates the following updates:1) Sections: a) Adds Qualification and Class B Support information to page 1.b) Updates the notes in all pin diagrams, updates Section 4.1.1 �Program Memory Organization� and Section 6.4 �Enhanced In-Circuit Serial Programming�c) Removes all references of the CCPxSTATH status register.2) Tables:a) Updates Table 4-1, Table 4-6, Table 4-7, Table 8-1, Table 8-2 and Table 10-1. b) Adds Table 32-24 through Table 32-33.3) Figures:a) Updates Figure 3-2. b) Adds Figure 32-5 through Figure 32-18.4) Registers:a) Updates Register 7-1.Impacts to Data Sheet: NoneReason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 24 March 2020NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
Statut du produit:
Microchip PIC24FJ256GA702-I/SP - Caractéristiques techniques
| Family Name: | PIC24F |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 256kB |
| RAM Size: | 16kB |
| Speed: | 16MHz |
| No of I/O Lines: | 22 |
| InterfaceType / Connectivity: | IrDA/I2C/LIN/PMP/PSP/SPI/UART/USART |
| Peripherals: | Brown-out Detect/DMA/LCD/LVD/POR/PWM/Reset/Watchdog |
| Number Of Timers: | 3 |
| Supply Voltage: | 2V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 10-chx10-bit / 10-chx12-bit |
| Watchdog Timers: | 1 |
| Style d'emballage : | SPDIP-28 |
| Méthode de montage : | Through Hole |
Emballages disponibles
Qté d'emballage(s) :
15 par Tube
Style d'emballage :
SPDIP-28
Méthode de montage :
Through Hole