Livraison gratuite aux États-Unis continentaux à partir de 50 $ US. Des conditions s'appliquent
Les commandes expédiées à l’extérieur des États-Unis seront en attente pendant que l’entreprise évalue les impacts tarifaires.Veuillez contacter votre vendeur pour obtenir de l’aide.
Référence fabricant
6-534998-2
24 Position 2.54 mm Solder Straight Through Hole Connector Socket
|
|
|||||||||||
|
|
|||||||||||
| Nom du fabricant: | TE Connectivity | ||||||||||
| Emballage standard: |
Product Variant Information section
Emballages disponiblesQté d'emballage(s) :1080 par Tube Méthode de montage :PCB Mount |
||||||||||
| Code de date: | 2529 | ||||||||||
TE Connectivity 6-534998-2 - Spécifications du produit
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
*** Cancellation of PCN 113385 - The PdNi+Au flash plating implementation for the parts in PCN-25-246311 has been postponed to October 2026 and New PCN will be issued for the Pdni +Au flash Plating implementation ***Product Description: MOD II & IV RECEPTACLE ASSEMBLYKind of Change:PCN CancellationGeneral Description of ChangesPlating optimization for MOD II & MOD IV Receptacle assembly. Before: (1) Current localized Gold Plating: 0.76 m(30 in) Au plating on contact area. (2) Current localized Gold Plating: 0.25 m(10 in) Au plating on contact area. After: (1) New localized Gold Plating: 0.66 m(26 in) PdNi+ 0.1 m(4 in) Au flash on contact area. (2) New localized Gold Plating: 0.15 m(6 in) PdNi+ 0.1 m(4 in) Au flash on contact area. Note: The Pd-Ni + Au flash plating has been validated for MOD II & MOD IV Receptacle assembly connector and test report is attached for reference.Reason for Cancellation:To ensure a smooth changeover and allow sufficient transition time to customer as requested.Remarks:1) The PdNi+Au flash plating implementation for the parts in PCN-25-246311 has been postponed to October 2026. 2) New PCN will be issued for the Pdni +Au flash Plating implementation.
Description of ChangesPlating optimization for MOD II & MOD IV Receptacle assembly. Before: (1) Current localized Gold Plating: 0.76 m(30 in) Au plating on contact area. (2) Current localized Gold Plating: 0.25 m(10 in) Au plating on contact area. After: (1) New localized Gold Plating: 0.66 m(26 in) PdNi+ 0.1 m(4 in) Au flash on contact area. (2) New localized Gold Plating: 0.15 m(6 in) PdNi+ 0.1 m(4 in) Au flash on contact area. Note: The Pd-Ni + Au flash plating has been validated for MOD II & MOD IV Receptacle assembly connector and test report is attached for reference.Reason for Changes:Product Improvement - Optimization of Plating for MOD II & MOD IV Receptacle assembly (Au plating to PdNi+Au ash plating)
Statut du produit:
-
https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=6-534998-2&field4=TE Connectivity&field18=https://p1na.futureelectronics.com/fr/it/p/interconnect--dual-in-line-package-sockets/6-534998-2-te-connectivity-8038602
-
-
https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=6-534998-2&field4=TE Connectivity&field18=https://p1na.futureelectronics.com/fr/it/p/interconnect--dual-in-line-package-sockets/6-534998-2-te-connectivity-8038602
TE Connectivity 6-534998-2 - Caractéristiques techniques
| Méthode de montage : | PCB Mount |
Emballages disponibles
Qté d'emballage(s) :
1080 par Tube
Méthode de montage :
PCB Mount