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Référence fabricant
MCP6024T-E/SL
MCP6024 Series 5.5 V 10 MHz Rail-to-Rail I/O Operational Amplifier SOIC-14
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :2600 par Reel Style d'emballage :SOIC-14 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | |||||||||||
Microchip MCP6024T-E/SL - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
*** Update for PCN 110836 ***Revision History: February 11, 2025: Issued initial notification.October 30, 2025: Issued final notification.Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families of 120k technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe ? Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 14 November 2025 (date code: 2546)
Description of Change: Qualification of Microchip Technology Gresham ? Fab 4 (GRTM) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (GRTM - FAB 4), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
Microchip has released a new Datasheet for the MCP6021/1R/2/3/4 - Rail-to-Rail Input/Output, 10 MHz Op Amps of devices. Notification Status: FinalDescription of Change: • Added Section “Product Identification System (Automotive)”.• Updated 6.0 “Packaging Information”Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 12 Apr 2023
Qualification of palladium coated copper (PdCu) bond wire and 3280 die attach epoxy in selected products of the 120K and 121K wafer technologies available in 14L SOIC package at MTAI assembly site.Pre Change: Gold wire and 8390A die attach epoxyPost Change: PdCu wire and 3280 die attach epoxy or Gold wire and 8390A die attach epoxy.Reason for Change: To improve manufacturability and qualify PdCu bond wire at MTAI assembly site.NOTE: Please be advised that after the estimated first ship date customers may receive pre and post change parts.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP6024T-E/SL&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/it/p/semiconductors--analog--amplifiers--general-purpose/mcp6024t-e-sl-microchip-7995855
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MCP6024T-E/SL&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/it/p/semiconductors--analog--amplifiers--general-purpose/mcp6024t-e-sl-microchip-7995855
Microchip MCP6024T-E/SL - Caractéristiques techniques
| No of Channels: | 4 |
| Slew Rate-Nom: | 7V/µs |
| Input Offset Voltage-Max: | 500µV |
| Style d'emballage : | SOIC-14 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
2600 par Reel
Style d'emballage :
SOIC-14
Méthode de montage :
Surface Mount