
Manufacturer Part #
MIC2250YML-TR
MIC2250 Series 5.5 V 2.5 MHz High-Efficiency Low EMI Boost Regulator - MLF-8
Microchip MIC2250YML-TR - Product Specification
Shipping Information:
ECCN:
PCN Information:
***UPDATE OF PCN109142***Description of Change: Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change: To improve on-time delivery performance by qualifying UNIG as a new assembly site.Estimated First Ship Date: 30 June 2025 (date code: 2527)
Description of Change: Qualification of Microchip Technology Colorado ? Fab 5 (MCSO) as a new fabrication location for selected 161-699102, MAQ3203, MIC21xx, MIC22xx, MIC25xx, MIC32xx,MIC422x, MIC44Fxx, MIC682xx, MIC68400, MIC68401, MIC691xx, MIC6930, MIC69502, MIC79110 and MIC920 device families of 2AK (BCD12) technology available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO - FAB 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand.
PCN Status:Initial NotificationDescription of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:October 2024
Revision History:May 29, 2023: Issued initial notification.May 24, 2024: Issued final notification. Attached the Qualification Report. Revised the affected parts list due to updated scope. Provided estimated first ship date to be on June 14, 2024.Description of Change:Qualification of UNIG as a new final test site for various products available in Tube, Tray and Tape & Reel packing media.Reason for Change:To improve manufacturability and on-time delivery performance by qualifying UNIG as a new final test site.
Description of Change:Qualification of UNIG as a new assembly site for various products available in Tube, Tray and Tape & Reel packing media.Pre and Post Change Summary: see attachedmpacts to Data Sheet:NoneChange Impact:NoneReason for Change:To improve on-time delivery performance by qualifying UNIG as a new assembly site.Change Implementation Status:In ProgressEstimated Qualification Completion Date:June 2024
Part Status:
Microchip MIC2250YML-TR - Technical Attributes
Topology: | Boost |
Input Voltage: | 2.5V to 5.5V |
Output Current-Max: | 2A |
Switching Frequency-Max: | 2.5MHz |
Package Style: | MLF-8 |
Mounting Method: | Surface Mount |
Features & Applications
Available Packaging
Package Qty:
5000 per Reel
Package Style:
MLF-8
Mounting Method:
Surface Mount