Les commandes expédiées à l’extérieur des États-Unis seront en attente pendant que l’entreprise évalue les impacts tarifaires.
Veuillez contacter votre vendeur pour obtenir de l’aide.
Référence fabricant
MAX24288ETK2T
Microchip MAX24288ETK2T - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change:Qualification of G700LA as a new mold compound material for selected MAX24x8x device family available in 68L WQFN (8x8x0.8mm) package assembled at ASCL assembly siteImpacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve manufacturability by qualifying G700LA as a new molding compound material.Change Implementation Status:In ProgressEstimated First Ship Date:January 20,2023 (date code: 2303)
PCN Status:Initial NotificationPCN Type:Manufacturing ChangeDescription of Change:Qualification of G700LA as a new mold compound material for selected MAX24x8x device family available in 68L WQFN (8x8x0.8mm) package assembled at ASCL assembly site.Impacts to Data Sheet:NoneChange ImpactNoneReason for Change:To improve manufacturability by qualifying G700LA as a new molding compound material.Change Implementation Status:In ProgressEstimated Qualification Completion Date:July 2022
Statut du produit:
Emballages disponibles
Qté d'emballage(s) :
2700 par Std. Mfr. Pkg