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Référence fabricant
CY7C1514KV18-250BZI
CY7C1514V18 72 Mb (2 M x 36) 250 MHz 1.8 V QDR™-II 2-Word Burst SRAM - FBGA-165
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| Nom du fabricant: | Infineon | ||||||||||
| Emballage standard: |
Product Variant Information section
Emballages disponiblesQté d'emballage(s) :136 par Tray Style d'emballage :FBGA-165 Méthode de montage :Surface Mount |
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Infineon CY7C1514KV18-250BZI - Spécifications du produit
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
Detailed change informationSubject: Change of label affecting dedicated Memory Solutions products: addition of HAL-free markReason:Standardization of labelling for Infineon products. Deeper integration of supply chain and detailed assessment confirmed HAL-free products in Infineon portfolio. Deliveries will start with 25.02.2025 to cascade information to Infineon customers with utmost urgency.Intended start of delivery 2025-02-25
Detailed change information:Change of lot naming convention in Infineon Technologies (Thailand) Limited, Nonthaburi, Thailand for subject memory productsReason:The lot numbering identification changing from 10 digit to 11 digit for whole Bangkok site according to the global Infineon standardlot numbering system manufacturing strategy.
Statut du produit:
Infineon CY7C1514KV18-250BZI - Caractéristiques techniques
| Memory Density: | 72Mb |
| Memory Organization: | 2M x 36 |
| Supply Voltage-Nom: | 1.7V to 1.9V |
| Temperature Grade: | Industrial |
| Speed: | 250MHz |
| Number of Words: | 2M |
| Word Length: | 36b |
| Supply Current: | 790mA |
| Interface Type: | Parallel |
| Operating Temp Range: | -40°C to +85°C |
| Storage Temperature Range: | -65°C to +150°C |
| Moisture Sensitivity Level: | 3 |
| Style d'emballage : | FBGA-165 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
136 par Tray
Style d'emballage :
FBGA-165
Méthode de montage :
Surface Mount