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Référence fabricant
MCP1415T-E/OT
MCP1415 Series 1.5 A High-Speed Power MOSFET Driver - SOT-23-5
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: |
Product Variant Information section
Emballages disponiblesQté d'emballage(s) :3000 par Reel Style d'emballage :SOT-23-5 (SOT-25) Méthode de montage :Surface Mount |
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| Code de date: | 2521 | ||||||||||
Microchip MCP1415T-E/OT - Spécifications du produit
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
*** Update for PCN 117502 ***Revision History: November 20, 2025: Issued initial notification. February 13, 2026: Re-issued initial notification to add MCP1401T-E/OT, MCP1402T-E/OT, MCP1416T-E/OT and MCP1415T-E/OT catalog part numbers in the affected parts list. Updated notification subject, qualification plan title and purpose to reflect the additional parts. Updated the pre and post change table to add CRM-1151GA die attach material in the pre change. Revised the Estimated Qualification Completion Date from November 2025 to February 2026.Description of Change: Qualification of CuPdAu as a new wire material for MCP1401T-E/OT, MCP1402T-E/OT, MCP1416RT-E/OT, MCP1415RT-E/OT, MCP1416T-E/OT and MCP1415T-E/OT catalog part numbers (CPN) available in 5L SOT-23 package.Reason for Change: To improve manufacturability by qualifying CuPdAu as a new wire material.Estimated Qualification Completion Date: February 2026
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material for MCP1415T-E/OT, MCP1401T-E/OT, MCP1402T-E/OT and MCP1416T-E/OT catalog part numbers (CPN) available in 5L SOT-23 package at MMT assembly site.Reason for Change: To improve manufacturability by qualifying palladium coated copper with gold flash (CuPdAu) as a new wire material.Change Implementation Status: In ProgressEstimated Qualification Completion Date: March 2026
***UPDATE OF PCN115155***Revision History: August 12, 2025: Issued initial notification.October 16, 2025: Issued final notification. Updated affected part list to removeDescription of Change: Qualification of CRM-1151GA as new die attach material for selected various device families available in 5L SOT-23 and 6L SOT-23 packages at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.Estimated First Ship Date: 06 November 2025 (date code: 2545)
*** Update for PCN 110961 ***Description of Change: Qualification of Microchip Technology Colorado – Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Pre and Post Summary Changes:• Pre Change: Fabrication Site = Microchip Technology Tempe – Fab 2(TMGR), Wafer Size = 8"• Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO – Fab 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe – Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated First Ship Date: 30 September 2025 (date code: 2540)Revision History: February 19, 2025: Issued initial notification.September 04, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on September 30, 2025.
Description of Change: Qualification of CRM-1151GA as new die attach material for selected various device families available in 5L SOT-23 and 6L SOT-23 packages at MMT and MTAI assembly sites.Reason for Change: To improve manufacturability by qualifying CRM-1151GA as a new die attach to standardize the use of PFAS-free material.
Description of Change: Qualification of Microchip Technology Colorado – Fab 5 (MCSO) as a new fabrication location for multiple device families available in various packages.Reason for Change: To improve manufacturability and on time delivery performance by qualifying a new fabrication location (MCSO – Fab 5), which is a Microchip-owned facility that offers significant expansion potential to better meet future client demand. *Note: The attached file called Tempe_Fab2_IATF_Decertification is for the manufacturing site deactivation of Microchip Technology Tempe – Fab 2 (TMGR), contact your local Microchip sales office for inquiries.Estimated Qualification Completion Date: July 2025Pre and Post Summary Changes:• Pre Change: Fabrication Site = Microchip Technology Tempe – Fab 2(TMGR), Wafer Size = 8"• Post Change: Fabrication Site = Microchip Technology Colorado(MCSO), Wafer Size = 6"
Statut du produit:
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Microchip MCP1415T-E/OT - Caractéristiques techniques
| Configuration: | Low Side |
| No of Outputs: | Dual |
| Output Impedance: | 6Ω |
| Peak Output Current: | 1.5A |
| Supply Voltage-Max: | 18V |
| Style d'emballage : | SOT-23-5 (SOT-25) |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
The MCP1415T-E/OT is a 1.5 A, 18 V Tiny High Speed MOSFET Driver, available in SOT-23-5 package.
The MOSFET drivers have other applications besides driving the gate of a MOSFET and are also used to direct drive a a small DC motor, act as buffers for high speed data lines, and level translators to interface low voltage to high voltage.
Features:
- High Peak Output Current: 1.5 A (typical)
- Wide Input Supply Voltage Operating Range: 4.5 V to 18 V
- Low Shoot-Through/Cross-Conduction Current in Output Stage
- High Capacitive Load Drive Capability:
- 470 pF in 13 ns (typical)
- 1000 pF in 20 ns (typical)
- Short Delay Times: 41 ns (tD1), 48 ns (tD2) (typical)
- Low Supply Current:
- With Logic ‘1’ Input - 0.65 mA (typical)
- With Logic ‘0’ Input - 0.1 mA (typical)
- Latch-Up Protected: Will Withstand 500 mA Reverse Current
- Logic Input Will Withstand Negative Swing Up to 5V
- Space-saving 5L SOT-23 Package
Applications:
- Switch Mode Power Supplies
- Pulse Transformer Drive
- Line Drivers
- Level Translator
- Motor and Solenoid Drive
Emballages disponibles
Qté d'emballage(s) :
3000 par Reel
Style d'emballage :
SOT-23-5 (SOT-25)
Méthode de montage :
Surface Mount