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Référence fabricant
KSZ8081RNAIA-TR
10/100 BASE-TX PHYSICAL LAYER TRANSCEIVER
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| Nom du fabricant: | Microchip | ||||||||||
| Emballage standard: | Product Variant Information section Emballages disponiblesQté d'emballage(s) :1000 par Style d'emballage :QFN-24 Méthode de montage :Surface Mount | ||||||||||
| Code de date: | 2339 | ||||||||||
Microchip KSZ8081RNAIA-TR - Spécifications du produit
Informations de livraison:
ECCN:
Informations PCN:
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new wire material for KSZ8081RNACA, KSZ8081RNACA-TR, KSZ8081RNAIA-TR, KSZ8081RNDCA TR, KSZ8081RNDIA-TR, KSZ8091RNACA-TR, KSZ8091RNAIA-TR, KSZ8091RNDCA-TR, KSZ8091RNDIA-TR, SPNY801142-TR, SPNY801143-TR, SPNY801147-TR, SPNZ801128-TR, SPNZ801143 and SPNZ801143-TR catalog part numbers (CPN) available in 24L VQFN (4x4x0.9mm) package.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated First Ship Date: 23 January 2026 (date code: 2604)
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:Qualification of a new lead frame with more Ag area on DAP surface prep for selected KSZ8081 and KSZ8091 device families available in 32L VQFN (5x5x0.9mm) package assembled at MTAI assembly site.Reason for Change:To improve productivity by qualifying new lead frame with more Ag area on DAP surface prep.Change Implementation Status:In ProgressEstimated First Ship Date:December 30, 2022 (date code: 2253)
Description of Change:Qualification of FH-SC13/HR-5104 as new die attach material and G700LTD mold compound for selected Atmel ATA5577M1330C-UFQW and ATA5577M133DC-UFQW catalog part numbers (CPN) available in 2L XDFN (1.5x2x0.37mm) package at NSEB assembly site.Reason for Change:To improve productivity and on-time delivery performance by qualifying FH-SC13/HR-5104 as new die attach material and G700LTD mold compound at NSEB assembly site.Change Implementation Status:In ProgressEstimated First Ship Date:January 15, 2023 (date code: 2303)
Description of Change:Qualification of a new lead frame with more Ag area on DAP surface prep for selected KSZ8081 and KSZ8091 device families available in 32L VQFN (5x5x0.9mm) package assembled at MTAI assembly site.Reason for Change:To improve productivity by qualifying new lead frame with more Ag area on DAP surface prep.
Statut du produit:
- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=KSZ8081RNAIA-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--comm-products--switch/ksz8081rnaia-tr-microchip-4191328
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- https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=KSZ8081RNAIA-TR&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--comm-products--switch/ksz8081rnaia-tr-microchip-4191328
Microchip KSZ8081RNAIA-TR - Caractéristiques techniques
| Supply Voltage-Nom: | 3.3V |
| No of Functions / Channels: | 2 |
| Interface Type: | RMII |
| Style d'emballage : | QFN-24 |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
1000 par
Style d'emballage :
QFN-24
Méthode de montage :
Surface Mount