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Référence fabricant
MSC080SMA120S
1200 V 35 A 182 W 80 mOhm Surface Mount N-Channel mSiC™ MOSFET- D3PAK
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| Nom du fabricant: | Microchip | ||||||||||
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Product Variant Information section
Emballages disponiblesQté d'emballage(s) :30 par Tube Style d'emballage :TO-268 (D3PAK) Méthode de montage :Surface Mount |
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Microchip MSC080SMA120S - Spécifications du produit
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
Description of Change:Implement packing material changes for selected PSDS and SIC products available in SOT-227, TO-220, TO-247, TO-263 and TO-268 packages at FSTS and TEAM final test sites.Reason for Change:To improve productivity by implementing packing material changes for selected PSDS and SIC products.
Description of Change:• Document migrated from Microsemi template to Microchip template; Assigned Microchip literature number DS-00005352A, whichreplaces the previous Microsemi literature number 050-7765.• Added Figure 1-9• Updated 2.1. Package Outline Drawing• Added 2.2. Recommended Land PatternReason for Change: To improve productivity.Data Sheet link: https://www.microchip.com/mymicrochip/filehandler.aspx?documentid=e9d248ec-7809-4454-9f70-d9aefd75b324
Revision History:May 12, 2023: Issued initial notification.May 28, 2024: Issued cancellation notificationDescription of Change:This qualification was originally performed to qualify Microchip Technology Colorado ? Fab 5 (MCSO) as an additional fabrication site for selected 700V, 1200V and 1700V SiC MOSFET products of MSCxxxSMA070xx, MSCxxxSMA120xx, MSCxxxSMA170xx device families available in die sales products, 2L TO-268, 4L SOT-227, 3L/4L TO-247 and 7L TO-263.Reason for Change:Microchip has decided to not qualify Microchip Technology Colorado ? Fab 5 (MCSO) as an additional fabrication site for selected 700V, 1200V and 1700V SiC MOSFET products of MSCxxxSMA070xx, MSCxxxSMA120xx, MSCxxxSMA170xx device families available in die sales products, 2L TO-268, 4L SOT-227, 3L/4L TO-247 and 7L TO-263.
Revision History:February 26, 2024: Issued initial notification.May 24, 2024: Issued final notification. Provided estimated first ship date to be on June 29, 2024.Description of Change:Qualification of MG15F-0140B as a new mold compound for selected MSC01xx, MSC03xx, MSC09xx, MSC18xx, MSC04xx, MSC05xx, MSC36xx, MSC06xx, MSC02xx, MSC75xx, and MSC08xx device families available in 2L TO-268 package.Reason for Change:To improve manufacturability by qualifying MG15F-0140B as a new mold compound.
Description of Change:Qualification of MG15F-0140B as the new mold compound for selected MSC01xx, MSC03xx, MSC09xx, MSC18xx, MSC04xx, MSC05xx, MSC36xx, MSC06xx, MSC02xx, MSC75xx, and MSC08xx device families available in 2L TO-268 package.Reason for Change:To improve manufacturability by qualifying MG15F-0140B as the new mold compound.
Revision History:May 09, 2023: Issued initial notification.December 05, 2023: Re-issued initial notification to add MSC025SMA120D/S-C25, MSC017SMA120D/S-C25, MSC040SMA120D/S-C25, MSC080SMA120D/S-C25,MSC015SMA070D/S-C25, MSC060SMA070D/S-C25, MSC035SMA170D/S-C25 catalog part numbers (CPNs) in the affected parts list.Revision of Qual Report Availability and Final PCN Issue Date from ?September 29, 2023? to ?August 30, 2024?.Description of Change:Implementation of Die Overcoat material with Polyimide layer selected Microsemi SIC MOSFET product of MSCxxxSMA070, MSCxxxSMA120, and MSCxxxSMA170 devicefamilies in DICE, SOT-227, TO-247, TO-263 and TO-268 packages.Reason for Change:To improve productivity by implementing Die Overcoat (polyimide layer)
Description of Change:Qualification Microchip Technology Colorado ? Fab 5 (MCSO) as an additional fabrication site for selected 700V, 1200V and 1700V SiC MOSFET products of MSCxxxSMA070xx, MSCxxxSMA120xx, MSCxxxSMA170xx device families available in die sales products, 2L TO-268, 4L SOT-227, 3L/4L TO-247 and 7L TO-263.Reason for Change:To improve productivity and on-time delivery performance by qualifying MCSO as an additional fabrication site.
Description of Change:Implementation of Die Overcoat material with Polyimide layer selected Microsemi SIC MOSFET product of MSCxxxSMA070, MSCxxxSMA120, and MSCxxxSMA170 device families in DICE, SOT-227, TO-247, TO-263 and TO-268 packages.Reason for Change:To improve productivity by implementing Die Overcoat (polyimide layer)
PCN Status:Final NotificationDescription of Change:Implement top marking changes for selected PSDS (Power Switching Discrete Solutions) Silicon Carbide (SiC) Products available in TO-247, TO-263, TO-268, TO-220 and SOT-227 packages.Reason for Change:To improve productivity by standardizing the top marking as part of the integration of Microsemi and Microchip.Change Implementation Status:In ProgressEstimated First Ship Date:March 31, 2023 (date code: 2313)
Statut du produit:
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MSC080SMA120S&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--discretes--transistors--silicon-carbide-mosfets-sic-mosfets/msc080sma120s-microchip-9114858
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https://futureelec.wufoo.com/forms/?formname=r8bzou01ws8brs&field12=NA&field16=fr&field2=MSC080SMA120S&field4=Microchip&field18=https://p1na.futureelectronics.com/fr/p/semiconductors--discretes--transistors--silicon-carbide-mosfets-sic-mosfets/msc080sma120s-microchip-9114858
Microchip MSC080SMA120S - Caractéristiques techniques
| Technology: | SiC (Silicon Carbide) Schottky |
| Product Status: | Active |
| Fet Type: | N-Ch |
| No. of Channels: | 1 |
| Drain-to-Source Voltage [Vdss]: | 12V |
| Drain Current: | 35A |
| Input Capacitance: | 838pF |
| Power Dissipation: | 182W |
| Operating Temp Range: | -55°C to +175°C |
| Style d'emballage : | TO-268 (D3PAK) |
| Méthode de montage : | Surface Mount |
Emballages disponibles
Qté d'emballage(s) :
30 par Tube
Style d'emballage :
TO-268 (D3PAK)
Méthode de montage :
Surface Mount