
Manufacturer Part #
DSPIC33FJ16GS502-I/MM
dsPIC33F Series 2 kB RAM 16 kB Flash 16-Bit Digital Signal Controller - QFN-S28
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Mfr. Name: | Microchip | ||||||||||
Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:61 per Tube Package Style:QFN-S28 Mounting Method:Surface Mount | ||||||||||
Date Code: | 2029 |
Product Specification
Shipping Information:
ECCN:
PCN Information:
ERRATA - dsPIC33FJ06GS101/X02 and dsPIC33FJ16GSX02/X04 Family Silicon Errata and Data Sheet ClarificationDescription of Change: 1) Added new silicon issue 52 (PWM). 2) This revision shows modified bit representation (e.g., bits<3:0> have been changed to bits[3:0]). This is done to be consistent with documents that were created in the SDL software.NOTE: Please be advised that this is a change to the document only the product has not been changed.
Revision History:July 13, 2017: Issued initial notification.August 02, 2018: Issued final notification. Attached the Qualification Report. Provided estimated first ship date on September 02, 2018.Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products of the 0.25um TSMC wafer technology available in 28L QFN-S package at NSEB assembly site.Pre Change: Using gold (Au) bond wire, 8200T or 8600 die attach and G770HCD or G700LTD mold compound material.Post Change: Using palladium coated copper with gold flash (CuPdAu) bond wire, 8600 die attach and G700LTD mold compound material.Reason for Change:To improve manufacturability by qualifying CuPdAu bond wire at NSEB assembly site.Estimated First Ship Date:September 02, 2018 (date code: 1836)
Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um TSMC wafer technology available in 28L QFN-S, 64L, 44L and 28L QFN packages.Pre Change: Assembled at MTAI assembly site using gold (Au) wire.Post Change: Assembled at MTAI assembly site using gold (Au) wire and MMT assembly site using palladium coated copper wire with gold flash (CuPdAu).Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site using palladium coated copper wire with gold flash (CuPdAu).Estimated First Ship Date:July 25, 2018(date code: 1830)
Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um, 0.18um TSMC, 70nm SMIC, Vanguard,120K,130K, 150K, 160K, 165K, 200K and 290K wafer technologies in 44L, 28 QFN-S, 20L,16L and 28L QFN packages.Pre Change:Assembled at MTAI assembly site.Post Change:Assembled at MTAI or MMT assembly site.Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site Estimated First Ship Date:June 24, 2018 (date code:1826)
Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um, 0.18um TSMC, 70nm, SMIC, Vanguard,120K,130K, 150K, 160K, 165K, 200K and 290K wafer technologies available in 44L, 28L QFN-S, 20L,16L and 28L QFN packages..Pre Change: Assembled at MTAI assembly sitePost Change: Assembled at MTAI or MMT assembly siteReason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.Estimated Qualification Completion Date:April 2018
Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um, 0.18um TSMC, 70nm, SMIC, Vanguard,120K,130K, 150K, 160K, 165K, 200K and 290K wafer technologies available in 44L, 28L QFN-S, 20L,16L and 28L QFN packages.Pre Change: Assembled at MTAI assembly sitePost Change: Assembled at MTAI or MMT assembly siteReason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site.
Description of Change:Qualification of MMT as an additional assembly site for selected products of 0.25um TSMC wafer technology available in 64L,28L QFN-S, 44L and 28L packages.Pre Change: Assembled at MTAI assembly site using gold (Au) wire.Post Change: Assembled at MTAI assembly site using gold (Au) wire and MMT assembly site using palladium coated copper wire with gold flash (CuPdAu). Reason for Change:To improve on-time delivery performance by qualifying MMT as an additional assembly site using palladium coated copper wire with gold flash (CuPdAu).Estimated Qualification Completion Date: April 2018
Product Lifecycle:
Technical Attributes
Family Name: | dsPIC33F |
Core Processor: | dsPIC |
Program Memory Type: | Flash |
Flash Size (Bytes): | 16kB |
RAM Size: | 2kB |
Speed: | 40MHz |
No of I/O Lines: | 21 |
Peripherals: | POR/PWM/Watchdog |
Number Of Timers: | 3 |
Supply Voltage: | 3V to 3.6V |
Operating Temperature: | -40°C to +85°C |
On-Chip ADC: | 16-chx10-bit |
On-Chip DAC: | 4-chx10-bit |
Watchdog Timers: | 1 |
Package Style: | QFN-S28 |
Mounting Method: | Surface Mount |
Features & Applications
dsPIC33FJXXGSXXX SMPS & Digital Power Conversion 16-bit Digital Signal Controller. These devices offer features supporting common, multi-loop digital switch-mode power supplies (SMPS) and other digital power-conversion applications.
Features:
- Up to 40 MIPS Operation (at 3.0-3.6 V)
- 16 x 16 Fractional/Integer Hardware Multiply, Single Cycle Execution
- 32-bit by 16-bit Hardware Divider
- C Compiler Optimized Instruction Set System
- Internal oscillator and Phase-Locked Loop (PLL) with 120 MHz VCO
- On-chip LDO Voltage Regulator
- Multiple, Switchable Clock Modes for Optimum Performance and Power Management
- High-Speed PWM Module Features
- Up to Four PWM Generators with Four to Eight Outputs
- Dead Time for Rising and Falling Edges
- Duty Cycle Resolution of 1.04 ns for Dead-Time, Phase Shift, and Frequency
- On-the-Fly PWM Frequency, Duty Cycle and Phase Shift Changes
- High-Speed Analog Comparator
- Up to Four Analog Comparators
- 20 ns response time
- 10-bit DAC for each analog comparator
- DACOUT pin to provide DAC output High-Speed 10-Bit ADC
- 10-Bit Resolution
- Up to 12 Input Channels Grouped into Six Conversion Pairs
- 4 Msps or 2 Msps Conversion rate
- Up to 3 16-bit Timer Modules
- Up to 2 Input Capture and 2 Output Compare / PWM
Applications:
Available Packaging
Package Qty:
61 per Tube
Package Style:
QFN-S28
Mounting Method:
Surface Mount