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Manufacturer Part #
PIC24F32KA301T-I/SS
PIC24 16 Bit 32 MHz 32 KB Flash 2 kB RAM 512 B EEPROM Microcontroller - SSOP-20
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| Mfr. Name: | Microchip | ||||||||||
| Standard Pkg: | Product Variant Information section Available PackagingPackage Qty:1600 per Reel Package Style:SSOP-20 Mounting Method:Surface Mount | ||||||||||
| Date Code: | |||||||||||
Product Specification
Shipping Information:
ECCN:
PCN Information:
CCB 3254 and CCB 3254.001 Final Notice: Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products available in 20L and 28L SSOP package at MTAI assembly site Pre Change: Using palladium coated copper wire (PdCu) bond wire Post Change: Using palladium coated copper with gold flash (CuPdAu) bond wire.
Microchip has released a new DeviceDoc for the PIC24FV32KA304 Family Silicon Errata and Data Sheet Clarification of devices. Notification Status: FinalDescription of Change: Added data sheet clarification 1 (Electrical Characteristics).Impacts to Data Sheet: NoneReason for Change: To Improve ManufacturabilityChange Implementation Status: CompleteDate Document Changes Effective: 06 Apr 2018NOTE: Please be advised that this is a change to the document only the product has not been changed.Markings to Distinguish Revised from Unrevised Devices: N/A
Description of Change:Qualification of palladium coated copper with gold flash (CuPdAu) bond wire in selected products available in 20L and 28L SSOP package at MTAI assembly site.Pre Change: Using palladium coated copper wire (PdCu) bond wire.Post Change: Using palladium coated copper with gold flash (CuPdAu) bond wireReason for Change:To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) bond wire.Estimated Qualification Completion Date:April 2018
Description of Change: 1) Updated the data sheet reference to the latest revision (DS30009995E).2) Removed data sheet data sheet clarification 1 (Electrical Characteristics) since this has been addressed in the latest revision of the data sheet.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 24 Oct 2017NOTE: Please be advised that this is a change to the document only the product has not been changed.
Description of Change: 1) Changed the PGEC2/PGED2 44-Pin value to 9 in Table 1-3. 2) Removed the OFFCAL bit from Table 4-16 and Register 22-2. 3) Updated Register 6-1 to include the correct Programming Operations for NVMP<5:0>. 4) Updated Figure 22-1. 5) Updated footnotes in Register 25-2. 6) Updated ambient temperature under bias range in Section 29.0 Electrical Characteristics, updated the DC16 electrical specs in Table 29-21, updated the F20 FRC electrical specs in Table 29-3 and changed the Minimum Input Capture x requirement for IC15 TccP. 7) Other minor typographic and formatting corrections throughout.Impacts to Data Sheet: NoneReason for Change: To Improve Productivity
Product Lifecycle:
-
ROHS Compliant -
Lead Free
Technical Attributes
| Family Name: | PIC24F |
| Core Processor: | PIC |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 32kB |
| RAM Size: | 2kB |
| Speed: | 32MHz |
| No of I/O Lines: | 18 |
| InterfaceType / Connectivity: | IrDA/I2C/LIN/SPI/UART/USART |
| Peripherals: | HLVD/POR/PWM/Watchdog |
| Supply Voltage: | 1.8V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 12-chx12-bit |
| Watchdog Timers: | 1 |
| Package Style: | SSOP-20 |
| Mounting Method: | Surface Mount |
Available Packaging
Package Qty:
1600 per Reel
Package Style:
SSOP-20
Mounting Method:
Surface Mount
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