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Référence fabricant
ATSAMD20E17A-MU
SAMD20E Series 128 kB Flash 16 kB SRAM 48 MHz 32-Bit Microcontroller - QFN-32EP
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| Nom du fabricant: | Microchip | ||||||||||
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Product Variant Information section
Emballages disponiblesQté d'emballage(s) :490 par Tray Style d'emballage :QFN-32EP Méthode de montage :Surface Mount |
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Microchip ATSAMD20E17A-MU - Spécifications du produit
Informations de livraison:
Code HTS:
ECCN:
Informations PCN:
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire for selected ATSAMC20E1, ATSAMC20G1, ATSAMC21E1, ATSAMC21G1, ATSAMD20E1, ATSAMD20G1, ATSAMD21E1, ATSAMD21G1, ATSAML10E1, ATSAML11E1, ATSAML21E1, ATSAML21G1, ATSAML22G1, PD39210, PD69210, PD77010, PD77020, PIC32CM1216MC00048, and PIC32CM6408MC00048 device families available various packages at MTAI assembly site.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Change Implementation Status: In ProgressEstimated First Ship Date: 04 March 2026 (date code: 2610)
*** Update for PCN 115821 ***Revision History: September 10, 2025: Issued initial notification.October 22, 2025: Issued final notification. Attached the Qualification Report. Provided estimated first ship date to be on October 31, 2025. Added a 'Change (Yes/No)' column to the Pre and Post Change Summary table.Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected ATSAMD20E14, ATSAMC20E15A, ATSAMC20E16A, ATSAMC20E17A, ATSAMC20E18A, ATSAMC21E15A, ATSAMC21E16A, ATSAMC21E17A, ATSAMC21E18A, ATSAMD20E15, ATSAMD20E16, ATSAMD20E17, ATSAMD20E18, ATSAMD21E15, ATSAMD21E15L, ATSAMD21E16, ATSAMD21E16L, ATSAMD21E17, ATSAMD21E17L, ATSAMD21E18, ATSAML10E14A, ATSAML10E15A, ATSAML10E16A, ATSAML11E14A, ATSAML11E15A and ATSAML11E16A device families available in 32L VQFN (5x5x1mm) package.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.Estimated First Ship Date: 31 October 2025 (date code: 2544)
*** Update for PCN 115312 ***Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.Estimated First Ship Date:September 03, 2025 (date code: 2536)Revision History:July 22, 2025: Issued final notification.August 15, 2025: Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608A-MAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B MAH5O-T, ATECC508A-MAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608A-MAH4K-T, ATECC608A-MAH3P-T, ATECC608A MAH3Q-S, ATECC608A-MAH4W-T, ATECC608A-MAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508A-MAH2E-T, ATECC608A MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508A-MAH1C-S, ATECC508A-MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608A MAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B MAHSC-T, ATECC608A-MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.September 18, 2025: Re-issued the final notification to add PFAS Elimination and Die Attach Explanation file and updated the affected CPN list to remove ATMEGA8535L-8JU, AT89LP6440-20JU, X34070T-H/ST, LX34050QPW-TR, LX3302AQPW-TR-EASY, LX3302AQPW-TR-C01, LX34311T-H/ST, LX34070AT-H/ST, LX34070-H/ST, LX34050QPW, LX3302AQPW-EASY, LX34070T-H/STVAO, LX3302AQPW-TR, LX34050QPW-TR-VAO, LX3302AQPW-TR-GM, LX34311T-H/STVAO, LX34070AT-H/STVAO, LX34070-H/STVAO, LX3302AQPW and LX34050QPW-VAO.
Description of Change: Qualification of palladium coated copper with gold flash (CuPdAu) as a new bond wire material for selected ATSAMD20E14, ATSAMC20E15A, ATSAMC20E16A, ATSAMC20E17A, ATSAMC20E18A, ATSAMC21E15A, ATSAMC21E16A, ATSAMC21E17A, ATSAMC21E18A, ATSAMD20E15, ATSAMD20E16, ATSAMD20E17, ATSAMD20E18, ATSAMD21E15, ATSAMD21E15L, ATSAMD21E16, ATSAMD21E16L, ATSAMD21E17, ATSAMD21E17L, ATSAMD21E18, ATSAML10E14A, ATSAML10E15A, ATSAML10E16A, ATSAML11E14A, ATSAML11E15A and ATSAML11E16A device families available in 32L VQFN (5x5x1mm) package.Reason for Change: To improve productivity by qualifying palladium coated copper with gold flash (CuPdAu) as a new bond wire material.
****FPCN115312/FPCN114582 UPDATE/MATERIAL CHANGE*****Description of Change: Qualification of palladium-coated copper with gold flash (CuPdAu) as an additional bond wire material for selected ATSAMD21xx, ATSAMC21xx, ATSAMC20xx, ATSAMDA1xx, ATSAMD20xx, ATSAML22xx, ATSAML21xx, PIC32CM2xx, PIC32CM1xx, PIC32CM3xx, PIC32CM6xx, ATSAML10xx,ATSAML11xx and PIC32CM5xx device families available in 32L and 48L VQFN (5x5x1mm and 7x7x0.9mm) packages at MMT assembly site.Reason for Change: To improve manufacturability by qualifying palladium-coated copper with gold flash (CuPdAu) bond wire as an additional wire material.Estimated First Ship Date: 14 November 2025 (date code: 2546)
*****FPCN114582 UPDATE/MATERIAL CHANGEQualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.*Re-issued the final notification to update the qualification report list, which now includes either a link to the qual report or an attached PDF file for each CCB. Updated the affected CPN list to removed EOL'ed CPNS: ATECC608A-MAHLG-T, ATECC608A-MAHVL-T, ATECC608AMAHVM-T, ATECC508A-MAHPH-S, ATECC508A-MAHUW-T, ATECC608B-MAH5O-T, ATECC508AMAHKN-T, ATECC608B-MAHAF-S, ATECC508A-MAHKN-S, ATECC508A-MAH1A-T, ATECC608AMAH4K-T, ATECC608A-MAH3P-T, ATECC608A-MAH3Q-S, ATECC608A-MAH4W-T, ATECC608AMAHAC-S, ATECC608A-MAHD3-S, ATECC608A-MAHGA-T, ATECC608A-MAHGX-T, ATECC508AMAH2E-T, ATECC608A-MAH2B-T, ATECC608A-MAH2G-S, ATECC608A-MAHT2-B, ATECC508AMAH1C-S, ATECC508A MAH1Q-S, ATECC508A-MAH1Q-T, ATECC608A-MAH1G-S, ATECC608AMAH1G-T, ATECC608A-MAH1K-S, ATECC508A-MAHWW-S, ATECC508A-MAHWW-T, ATECC608B-MAHAK-S, ATECC608B-MAHPA-T, ATECC608B-MAHSB-T, ATECC608B-MAHSC-T,ATECC608A MAH2U-T, ATECC608A-MAH2V-S, ATECC608A-MAH2X-S, ATECC608A-MAH2Y-S, ATECC608A-MAH3J-T and ATECC608A-MAH1W-T.
Description of Change:Qualification of QMI519 as a new die attach material and CuPdAu as a new bond wire material for various products available in PLCC, QSOP, SOIC, SOIJ, SSOP, TSSOP, MQFP, TQFP, DFN, QFN, QFN-S, SQFN, TDFN, UDFN, UQFN, VDFN, VQFN, WQFN and TQFP packages assembled at MP3A, MTAI and MMT sites.Reason for Change:To improve manufacturability by qualifying QMI519 as a new die attach to standardize the use of PFAS free material and CuPdAu as a new bond wire material.September 03, 2025 (date code: 2536)
Description of Change:Updated the entire document to reflect new silicon revision H. Removed obsolete clarifications from Data Sheet ClarificationsAdded the following Errata:? Device: 1.5.22 One-Time Programmable Lock? SERCOM: 1.15.5 SERCOM I2C Client SDAHOLDReason for Change: To Improve Productivity
Microchip has released a new Datasheet for the SAM D20 Family Data Sheet of devices. Notification Status: FinalDescription of Change:SectionDescriptionPower Manager? Removed erroneous Clock Failure Detection content from the Overview? Removed erroneous Clock Failure Detection content from the Features? Updated Figure 15-2 in Selecting the Synchronous Clock Division Ratio? Removed erroneous Clock Failure Detection content from the Interrupts? Removed erroneous Clock Failure Detection content from the following registers:? CTRL? INTENCLR? INTENSET? INTFLAGSYSCTRL? Added a note to BOD33RDY in the PCLKSR Register? Removed erroneous Standby Sleep Mode from the ONDEMAND bitfield of the DFLLCTRL RegisterNVMCTRL? Added a new bullet of information to Procedure for Manual Page Writes (CTRLB.MANW=1)PORT - I/O? Updated the PINCFG Register Reset PropertyAC? Added a note to Offset CompensationSchematic Checklist? Removed an erroneous image from External Reset Circuit? Updated the MHz value in Table 36-5Impacts to Data Sheet: See above details.Reason for Change: To Improve ProductivityChange Implementation Status: CompleteDate Document Changes Effective: 03 Jan 2025
Statut du produit:
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Microchip ATSAMD20E17A-MU - Caractéristiques techniques
| Family Name: | SAMD20 |
| Core Processor: | ARM Cortex M0+ |
| Program Memory Type: | Flash |
| Flash Size (Bytes): | 128kB |
| RAM Size: | 16kB |
| Speed: | 48MHz |
| No of I/O Lines: | 26 |
| InterfaceType / Connectivity: | I2C/SPI/UART/USART |
| Peripherals: | Brown-out Detect/POR/Reset/Watchdog |
| Supply Voltage: | 1.62V to 3.6V |
| Operating Temperature: | -40°C to +85°C |
| On-Chip ADC: | 10-chx12-bit |
| On-Chip DAC: | 1-chx10-bit |
| Watchdog Timers: | 1 |
| Style d'emballage : | QFN-32EP |
| Méthode de montage : | Surface Mount |
Fonctionnalités et applications
Emballages disponibles
Qté d'emballage(s) :
490 par Tray
Style d'emballage :
QFN-32EP
Méthode de montage :
Surface Mount
